Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

Humanoid Robot Shipments to Reach 26M Units Annually by 2040

09/04/2026 | Berg Insight
According to a new research report from the IoT market research firm Berg Insight, the humanoid robotics industry has entered an early phase of long-term commercial growth.

IMAPS Symposium 2026: The Premier Event for Microelectronics Advanced Packaging

09/04/2026 | IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS) will host the 59th International Symposium on Microelectronics (IMAPS Symposium 2026) from September 28 to October 1, 2026, at the Encore Boston Harbor in Everett, Massachusetts.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

09/03/2026 | Michelle Te, I-Connect007
As a longtime journalist, I always find myself pulled in so many directions of curiosity. I’ve often felt like the saying, “A jack of all trades, master of none.” It seems to be the price I’ve paid as a writer and editor, delving into so many different corners of industry, community, and the human condition. But that’s also why I love this week’s collection of must-reads. From novel flexible circuits to modernizing IPC standards, a trade show in the burgeoning China Plus One region, Mexico’s manufacturing moment, and opportunities for workforce development, we’ve gone around the world and back again. We touch on so many aspects of the industry, and especially the opportunities and challenges of keeping up with change.

SEMI, Silicon Catalyst Aim to Accelerate Global Semiconductor Innovation with Strategic Partnership

09/03/2026 | SEMI
SEMI, the global industry association connecting the electronics design and manufacturing supply chain, and Silicon Catalyst, the world's only accelerator focused exclusively on semiconductor innovation, announced a global strategic partnership designed to accelerate innovation and strengthen connections between semiconductor hardware startups, investors, manufacturers, and technology leaders worldwide.

DoW Signs 7-Year Deals to Triple PAC-3 and Quadruple THAAD Production

08/31/2026 | U.S. Department of War
The Department of War (DoW) announced the signing of two pivotal framework agreements with General Dynamics Ordnance and Tactical Systems (GD-OTS) and Lockheed Martin.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in