-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
New, Integrated Solution From Rehm for Efficient Use of Nitrogen With the Coolflow Option
April 23, 2020 | Rehm Thermal SystemsEstimated reading time: 3 minutes

The VisionXP+ convection soldering system from Rehm Thermal Systems features different types of cooling.
For an optimal reflow soldering result, not only is melting of the solder important but also as a stable and reliable cooling process. This soldering process can be designed flexibly with the VisionXP+ convection soldering system from Rehm Thermal Systems. With Rehm CoolFlow, Rehm offers an innovative and integrated cooling principle using liquid nitrogen—there is also a standard cooling option with up to four cooling modules, an extended cooling line, underside cooling and an energy-saving cooling variant.
Along with their partner Air Liquide, Rehm has developed a cooling system (“Rehm CoolFlow”), which deploys the nitrogen used for inertia even more efficiently. The –180 °C cold liquid nitrogen releases its energy in the cooling line, then evaporates and can then be used in its gaseous state for inerting the process atmosphere. The cooling water, which previously required high energy use for cooling, including cooling unit and refrigerant, is completely eliminated. The entire nitrogen path—from the main valve, through the volume flow control and the safety sensors, to the passively controlled gaseous nitrogen supply—is now fitted in the plant housing. This means that all fittings are spatially integrated into the plant. Only a hose for gaseous nitrogen and a vacuum-insulated line for liquid nitrogen feed into the system from the outside. With the exception of hood coolers and the non-split cooling line, Rehm CoolFlow can be combined with all other options.
Cooling is controlled using the software by specifying the frequencies and volume flow rate as required: If the cooling line temperatures are too high, the operator increases the volume flow of liquid nitrogen through the coolers. Everything else is controlled by the system itself: An excess of nitrogen from the coolers is fed into the exhaust air to compensate for a shortfall from the gas network. Furthermore, the Rehm CoolFlow option has features that enable safe working. For instance, the supply of liquid nitrogen is automatically and safely stopped in case of a malfunction. Such measures address the challenges posed by nitrogen management.
In addition to the innovative CoolFlow solution, Rehm Thermal Systems offers flexible standard cooling concepts for VisionXP+. These include:
Standard cooling lines with up to four cooling modules
The standard cooling system consists of up to four individual cooling modules. These allow a precisely controlled cooling process as well as individual adjustment of the cooling gradient. The “closed loop principle” guarantees a closed atmosphere cycle. The standard cooling line consists of an active and a passive cooling module. The active cooling modules are supplied via an external water connection, using a heat exchanger. The coolers can be easily removed and cleaned at the rear of the system. The process chamber does not need to be opened to do this.
Flexible cooling with extended cooling line
For gentle cooling, an extended cooling line can be connected to the VisionXP+. This can be implemented as an extension to standard cooling zones under a nitrogen atmosphere or as a separate, downstream module in an air atmosphere for higher cooling performance for insensitive materials. Further advantages of the air-cooled variant: while nitrogen is needed in the process section of the convection unit to prevent oxidation, the extended cooling line no longer needs to be flooded with nitrogen, resulting in nitrogen savings.
Underside cooling for uniform cooling from above and below
For particularly massive or large assemblies or boards with product carriers, the VisionXP + can also be equipped with underside cooling. The actual cooling process is identical to that of the standard cooling line, but the extracted, cleaned and cooled air flows not only from above onto the module, but also from below.
Gradual cooling for energy saving
Rehm also offers an energy-saving cooling variant for the VisionXP+ convection soldering system: The air is extracted not only at one point but at two points. This results in a smoother cooling gradient and offers significant energy saving potential.
Image: Rehm Thermal Systems
About Rehm Thermal Systems
Rehm is a technology and innovation leader in the state-of-the-art, cost-effective manufacturing of electronic assembly groups. It specialises in thermal system solutions for the electronics and photovoltaics industry. Rehm is a globally active manufacturer of reflow soldering systems using convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallisation of solar cells and numerous customised systems. We have a presence in all key growth markets and, as a partner with 30 years of industry experience, we are able to implement innovative production solutions that set new standards.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.