Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
iNEMI Roadmap Highlights Series: Portable & Wireless and Smart Manufacturing
April 28, 2020 | iNEMIEstimated reading time: 1 minute
iNEMI Roadmap Highlights Series
Portable & Wireless - Wednesday, May 6, 2020
Smart Manufacturing - Wednesday, May 13, 2020
Webinars are open to anyone; advance registration is required.
Portable & Wireless
Highlights of iNEMI’s Portable & Wireless chapter will include critical factors that enable portable and wireless devices to continue leading electronics manufacturing in production volumes and technical breakthroughs. A variety of key products and services offered in the portable and wireless space demand innovations in advanced packaging, design and miniaturization. Transitioning from 4G LTE to 5G mmWave-based communications protocols introduces unique challenges that are expected to drive disruptive changes in packaging, testing strategies and integration trends in smartphone and other portable chipsets. Major trends such as cost and form factor, co-design and tool needs, shifts in the supply chain structure, and the impact of artificial intelligence (AI) and machine learning (ML) in the mobile space will be presented.
Session 1
Wednesday, May 6
11:00 a.m. EDT (Americas)
5:00 p.m. CEST (Europe)
Register for this webinar
Session 2
Thursday, May 7
8:00 a.m. CST (China)
5:00 p.m. PDT (Americas) on May 6
Register for this webinar
Smart Manufacturing
This high-level overview of iNEMI’s Smart Manufacturing chapter includes such topics as the industry’s current state of technologies as well as the gaps and challenges facing the implementation of Industry 4.0 and smart manufacturing practices. Smart manufacturing enabling technologies (e.g., big data analytics, artificial intelligence, cloud/edge computing, robotics, automation, IoT) will improve efficiency, safety and productivity in manufacturing. This webinar will summarize industry status across semiconductor, outsourced system assembly and test, and printed circuit board assembly sectors. It will also look at the key enabling technology needs in security, data flow architecture, and digital building blocks (e.g., artificial intelligence, machine learning and digital twin).
Smart Manufacturing
Wednesday, May 13
11:00 a.m. EDT
5:00 p.m. CEST (Europe)
Register for this webinar
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