-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueMoving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
BTU’s Fred Dimock to Host SMTA Solder Reflow Fundamentals Webinar
April 28, 2020 | BTU International, Inc.Estimated reading time: 1 minute

BTU International, Inc., a leading supplier of advanced thermal processing equipment for electronics manufacturing, is pleased to announce that Fred Dimock, manager of process technology, will host a webinar with the SMTA on Tuesday, May 26, 2020 from 10?11 a.m. CST.
This webinar is based on the solder reflow fundamentals class and reflow section of the Jump Start Program that was presented at SMTA International Rosemont, IL. It is designed for the new SMT engineers/technicians or current engineers who want a better understanding of the reflow process. It discusses recipes vs. profiles, heat transfer in a reflow oven, oven control, why profiles are shaped the way they are, and how to obtain profiles. Additional topics of discussion include TC accuracy and mounting, profilers, test vehicles and process windows.
Dimock has taught numerous SMTA solder reflow classes and has participated in the 5-45 subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard. He wrote the chapter on solder reflow for the Handbook of Electronic Assembly and A Guide to SMTA Certification by Dr. Lasky and Jim Hall.
Dimock holds an associate’s degree in Mechanical Design from Wentworth in Boston and a bachelor’s degree in Ceramic Engineering from the State University of New York at Alfred (SUNY). He has been recognized as a Distinguished Speaker status at SMTA Guadalajara and received several Best Vendor Presentation awards at the SMTA East China conferences.
Suggested Items
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.