Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
The Convergence of Technologies and Standards in Smart Manufacturing
April 29, 2020 | Ranjan Chatterjee, Cimetrix Inc., and Dan Gamota, Jabil Inc.Estimated reading time: 2 minutes
Editor’s note: Originally titled “The Convergence of Technologies and Standards Across the Electronic Products Manufacturing Industry (SEMI, OSAT, and PCBA) to Realize Smart Manufacturing,” this article was published as a paper in the Proceedings of the SMTA Pan Pacific Microelectronics Symposium and is pending publication in the IEEE Xplore Digital Library.
Abstract
The vertical segments of the electronic products manufacturing industry (semiconductor, outsourced system assembly, and test, and PCB assembly) are converging, and service offerings are consolidating due to advanced technology adoption and market dynamics. The convergence will cause shifts in the flow of materials across the supply chain, as well as the introduction of equipment and processes across the segments. The ability to develop smart manufacturing and Industry 4.0 enabling technologies (e.g., big data analytics, artificial intelligence (AI), cloud/edge computing, robotics, automation, IoT) that can be deployed within and between the vertical segments is critical. The International Electronics Manufacturing Initiative (iNEMI) formed a Smart Manufacturing Technology Working Group (TWG) that included thought leaders from across the electronic products manufacturing industry. The TWG published a roadmap that included the situation analysis, critical gaps, and key needs to realize smart manufacturing.
Introduction
The future of manufacturing in the electronics industry is dependent on the ability to develop and deploy suites of technology platforms to realize smart manufacturing and Industry 4.0. Smart manufacturing technologies will improve efficiency, safety, and productivity by incorporating more data collection and analysis systems to create a virtual business model covering all aspects from supply chain to manufacturing to customer experience. The increased use of big data analytics and AI enables the collection of large volumes of data and the subsequent analysis more efficient.
By integrating a portfolio of technologies, it has become possible to transition the complete product life cycle from supplier to customer into a virtual business model or cyber-physical model. Several industry reports project manufacturers will realize tens of billions of dollars in gains by 2022 after deploying smart manufacturing solutions. In an effort to facilitate the development and commercialization of the critical smart manufacturing building blocks (e.g., automation, machine learning, or ML, data communications, digital thread), several countries established innovation institutes and large R&D programs. These collaborative activities seek to develop technologies that will improve traceability and visualization, to enable real-time analytics for predictive process and machine control, and to build flexible, modular manufacturing equipment platforms for high-mix, low-volume product assembly.
To read this entire article, which appeared in the April 2020 issue of SMT007 Magazine, click here.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Photonics Systems Group Announces Exclusive After-Hours Tech Event at productronica 2025
11/05/2025 | Photonics Systems GroupPhotonics Systems Group (PSG), a leading expert in laser micromachining specifically for the electronics industry, announced its inaugural after-hours technical event, the Photonics Tech Evening, to be held on November 19, 2025, during Productronica 2025.
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
EMS and ODM Market Size to Surpass USD 1589.62 Billion by 2033, Rising at 7.40% CAGR
11/04/2025 | Globe NewswireAccording to the SNS Insider, “The EMS and ODM market size was valued at USD 900.09 Billion in 2025E and is projected to reach USD 1,589.62 Billion by 2033, growing at a CAGR of 7.40% during 2026–2033.”
Electronics Manufacturing Powers U.S. Growth, Supporting 5.2 Million Jobs and $1.8 Trillion in Output
11/03/2025 | Global Electronics AssociationNew report from Global Electronics Association shows electronics industry contributes $853 billion to GDP and delivers average annual wages exceeding $156,000, reinforcing its role as a pillar of U.S. economic resilience.
Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
11/04/2025 | Nolan Johnson -- Column: Nolan's NotesLast year, I attended SMTA Guadalajara, where I saw the results of the Mexican investment in electronics manufacturing. The U.S. was still operating under the Biden administration, and while Mexican EMS companies had expanded capacity to support EV manufacturing, the demand dropped significantly. In my conversations at the show, the sentiment was one of patience. They knew the EV business would likely come back. However, they didn’t expect an overhaul of U.S. trade agreements and tariffs that would shift a more diversified portfolio in Mexico’s direction.