Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
NextFlex Awards Over $11.5 Million in Funding for Flexible Hybrid Electronics Innovations in Hypersonics, Flexible Batteries and Anti-counterfeiting
April 29, 2020 | NextFlexEstimated reading time: 2 minutes
NextFlex®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, today announced $11.5 million in funding (including $6.3M in cost-share contribution from participants) for 12 new projects as part of its Project Call 5.0 to further promote FHE development and adoption throughout the U.S. advanced manufacturing sector.
Project Call 5.0’s awarded projects represent a diverse and innovative set of companies and universities that together are focused on maturing the industry’s capabilities while leveraging the strong foundation established in prior Project Calls. Included in this latest round of funded projects are applications that focus on aerospace, structural health monitoring and sophisticated array antennas to help move the manufacturing industry closer to volume manufacturing and commercialization. This latest round of funding brings the total amount invested in FHE developments to over $100M, including cost share contributions from prior Project Call participants.
“Despite these uncertain times, NextFlex and its members are forging ahead to deliver flexible, conformable, low-cost, thin and lightweight electronics solutions for a number of application areas, both for defense and commercial applications alike,” said Malcolm Thompson, Executive Director at NextFlex. “With several projects focused on the manufacturability and reliability of FHE systems and devices, this current round of funded projects demonstrates an overall maturation of FHE technology – which showcases the considerable progress and investment occurring within the advanced manufacturing sector despite aspects of the economy that be might temporarily stalled.”
The 12 winning projects will address reliability and process improvements in manufacturing automation and test protocols to ensure FHE systems perform at parity or better than traditional rigid systems. Furthermore, the projects will help to transition an increasing number of new capabilities into the U.S. industrial manufacturing sector for further advancement of the industry.
Project Call 5.0’s awarded funding will go to:
- Development led by Worcester Polytechnic Institute to enhance the endurance and resolution of inkjet printing for high volume digital manufacturing
- Development led by Binghamton University to demonstrate printed stretchable conductors for optimal mechanical and electrical performance
- Development led by SysteMECH to achieve consistent automated component attach for ultra-thin FHE systems and devices
- Development led by Hewlett Packard Enterprise to develop the FHE Process Design Kit (PDK) 2.0, expanding design tools and libraries to foster commercialization
- Development led by GE Global Research to develop scalable manufacturing processes for embedded sensors in composite structures
- Development led by Lockheed Martin Company for trusted FHE with a passive UHF-RFID tag with encrypted security features for authentication and tamper resistance
- Development led by Auburn University to test and evaluate flexible batteries and provide guidelines for performance and reliability
- Development led by The Boeing Company to additively manufacture durable high temperature electronics for hypersonic vehicles
- Development led by GE Global Research that will characterize additively manufactured electronics properties, interconnects, and processes capable of 300-750 degrees for hypersonic applications
- Development led by GE Global Research to design and produce reliable, flexible and conformal temperature and humidity sensors for extreme environments, in partnership with US Army CCDC-Armaments Center
- Development led by The Boeing Company to mature the manufacturing process of embedding antennas within fiberglass composite structures and validating RF performance for conformal antennas for telemetry, in partnership with Missile Defense Agency
- Development led by Lockheed Martin Company for flexible interconnects for large deployable x-band phased arrays that integrate fiber optics to reduce size and weight
For more information about NextFlex and the Project Call program, please visit https://www.nextflex.us/project-call/.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Kitron Reports Initiation of Share Buyback Program
09/08/2025 | KitronKitron ASA has decided to initiate a share buyback program of up to 16,000 of its own shares for a total maximum amount of NOK 900,000. The buyback program may be carried out in the period from this announcement and until 12 September 2025.
SisTech Manufacturing Elevates PCB Assembly Services with Cutting-Edge Innovations
09/08/2025 | Globe NewswireSisTech Manufacturing, a leader in precision electronic manufacturing services, has announced it will enhance its capabilities in printed circuit board assembly.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
Building Electronics Excellence in India
09/08/2025 | Nolan Johnson, SMT007 MagazineOver two decades, Dave Bergman has helped steer the Global Electronics Association’s work in India, from a single training course to a thriving regional operation with deep government and industry ties. In this interview, Dave explains how the group went from partnering with IPCA to opening its own office in 2010, creating India’s first domestic electronics manufacturing standard, and securing funding for dozens of Indian companies to attend U.S. trade shows.
HDI PCB Market Poised for Explosive Growth, Projected to Hit $34.23 Billion by 2032
09/04/2025 | Globe NewswireAccording to Coherent Market Insights (CMI), the global HDI PCB market size is projected to expand at a CAGR of 8.3% over the forecast period, reaching USD 19.59 Bn in 2025 and USD 34.23 Bn by 2032.