Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Happy’s Smart Factory Protocol Primer
April 29, 2020 | Happy Holden, I-Connect007Estimated reading time: 1 minute
The smart factory concept is built upon data interchange as the foundation. There has been much development in the area of industrial and manufacturing data protocols over the years, stretching back into the 1960s. This article surveys what are considered the most common protocols in use in the electronics manufacturing industry today, including IPC-CFX/ Hermes, OML, SECS/GEM, and MAPS.
Protocols for the Electronics Smart Factory
One way to shorten the development time of any smart factory automation protocol is to leverage what is already out there. Three protocols have already been established in electronics manufacturing:
1. IPC-2591 Connected Factory Exchange (CFX) with the IPC-9852 HERMES standard.
2. Mentor/Siemens Open Manufacturing Language (OML).
3. SEMI’s SECS/GEM-SEMI Equipment Communication Standard/Generic Equipment Model.
Modeling any PCB fabrication smart factory protocol after one or more of these existing standards will shorten their development time.
IPC-CFX/Hermes
An open network standard introduced by the IPC is IPC-2591 introduced in 2018 (Figure 1.) It establishes three critical elements for “plug and play” industrial IoT:
1. A message protocol using AMQP.
2. An encoding mechanism using JSON.
3. A specific content creation element, as well as structured topics and messages.
The Hermes standard is a low-level line control protocol that passes information up and down the equipment line, including PCB ID, program name, and key product data. These elements allow for the creation of automatic decision-making and dashboard displays, alerts, and reports. Applications that improve productivity, efficiency, capacity planning, and quality while lowering costs. It allows the full traceability of components (IPC-1782) and feedback to design (IPC-2581).
To read this entire article, which appeared in the March 2020 issue of SMT007 Magazine, click here.
Editor’s Note: This protocol overview was previously published as a section in “The Smart Factory: All the Bits and Bobs” by Happy Holden in the February 2020 issue of PCB007 Magazine. Click here to see the full article.
Share on:
Suggested Items
I-Connect007’s Editor’s Choice: Five Must-Reads for the Week
07/04/2025 | Marcy LaRont, I-Connect007For our industry, we have seen several bullish market announcements over the past few weeks, including one this week by IDC on the massive growth in the global server market. We’re also closely watching global trade and nearshoring. One good example of successful nearshoring is Rehm Thermal Systems, which celebrates its 10th anniversary in Mexico and the official opening of its new building in Guadalajara.
Hon Hai Education Foundation Continues to Promote Quantum Education
07/04/2025 | FoxconnHon Hai Education Foundation has long been committed to promoting forward-looking technology education in Taiwan's high schools, and held the "High School Quantum Teacher Training Camp" in Tainan City on July 1.
Incap UK Achieves JOSCAR Zero Accreditation
07/04/2025 | IncapIncap Electronics UK has been accredited under JOSCAR Zero, a new sustainability-focused extension of the defence and aerospace sector’s supplier assurance system.
Kitron Secures Contract for Components Supporting Unmanned Aerial Systems
07/04/2025 | KitronKitron has received a contract with an estimated value between EUR 4 and 8 million for the production and supply of advanced electronic components used in unmanned aerial systems (UAS).
NOTE Receives Order Worth 132 MSEK and Expands Collaboration with Customer within Security & Defense
07/04/2025 | NOTENOTE has received an order worth SEK 132 million from one of its existing customers operating within Security & Defense. NOTE thereby strengthens its long-term collaboration with the industry-leading customer.