Trackwise's 'Improved Harness Technology' Designed into Circuits for Electric Vehicles
April 30, 2020 | Trackwise Designs PLCEstimated reading time: 1 minute

Trackwise Designs has secured a production order for its flexible printed circuit technology, Improved Harness Technology™ (IHT), for delivery in mid 2020. This initial order, in support of initial vehicle production activities, follows successful funded development activities last year for this UK-based designer and manufacturer of electric vehicles.
Trackwise’s IHT is a proprietary roll-to-roll manufacturing process enabling the production of unlimited length, multilayer flexible printed circuits (FPCs). Trackwise’s roll-to-roll technology is being used to manufacture FPCs for use at a module level in both HV and LV circuits in the vehicles' battery packs, reducing the part count, assembly time, and saving on space and weight.
Electric vehicle battery modules are typically cuboid structures of packaged cells which have precisely defined cell connection or monitoring locations that are ideally suited to flex PCBs.
In addition, when battery modules are packaged together to form a complete vehicle battery pack, the battery modules can be connected together by long-length flex PCBs, sometime several metres in length.
Philip Johnston, CEO of Trackwise, commented: "The electric vehicle industry—and specifically EV battery packs—is one of a number of growth markets for Trackwise, and we are delighted to have been selected by an innovator in the field. Following successful development work last year and, more recently, the acquisition of Stevenage Circuits Ltd (SCL) at the beginning of April, this is the next step towards series production of IHT at scale."
Suggested Items
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.