-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Seika Partners with Cogiscan to Offer MSD Control for McDry Cabinets
May 6, 2020 | Seika Machinery, Inc.Estimated reading time: 1 minute

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced that it has partnered with Cogiscan to provide MSD Control for its McDry cabinets. As a result of the collaboration with Cogiscan, Seika offers precise tracking of the real-time location and remaining floor life of individual trays and reels containing MSDs—from the time they are removed from their protective dry bag, through placement, and final reflow.
Accurate adherence to the challenging guidelines and specifications of the J-STD-033 for Moisture Sensitive Devices (MSDs) can pose a challenge during circuit board assembly. Whether you rely on simplified procedures or over-bake your MSDs to be more conservative, you are likely wasting time and money as well as exposing yourself to actual failures in the field.
Cogiscan’s intelligent and automated MSD Control application is the ideal solution to better control and accurately track MSDs throughout your facility. With the introduction of MSD Control, Cogiscan has deciphered the complex rules, calculations and guidelines of the J-STD and simplified them into a single, simple and automated solution. With the MSD Control solution, users no longer need to remember complicated formulas nor keep track of hand-written calculations in order to keep circuit board assemblies with MSDs in full compliance.
Suggested Items
SolderKing Enhances Brainboxes' Electronics Manufacturing with Expert Support and Advanced Materials
03/26/2025 | SolderKingIn modern electronics manufacturing, success relies on more than high-quality soldering materials. Technical knowledge and process expertise are just as crucial for achieving consistent results. SolderKing, a leading UK manufacturer, provides both, combining advanced consumables with specialist support to help manufacturers optimise their soldering processes.
Altus Supplies Dual Lane Reflow Oven to Triple CEM’s Production Capacity
03/20/2025 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, has partnered with Garner Osborne Circuits, a UK-based Contract Electronics Manufacturer, to install a Dual Lane Heller 1707 MK7 reflow oven.
Solderstar to Present Advanced Profiling Solutions at IPC APEX EXPO 2025
02/04/2025 | SolderStarSolderstar, a leading provider of profiling solutions for the electronics manufacturing industry, will exhibit at IPC APEX EXPO 2025, which will take place March 18-20, 2025, at the Anaheim Convention Center in California.
YINCAE Launches UF 120LA
02/04/2025 | YINCAEYINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.
Incap India Invests in New SMT Technology
01/24/2025 | IncapIncap India has invested approximately EUR 1 million in a new SMT (surface-mount technology) production line at its third factory in Tumkur.