Airspan Networks Extends Collaboration with ON Semiconductor on Wi-Fi 6 Solutions for Fixed Wireless Access Applications

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Airspan Networks announced its collaboration with ON Semiconductor, driving energy efficient innovations, to capitalize on industry-leading Wi-Fi 6 performance solutions, utilizing the QCS-AX chipset for Fixed Wireless Access (FWA) applications.

With hundreds of thousands of sites deployed globally, Airspan is at the forefront of providing Communications Service Providers innovative wireless solutions for high-reliability public and private, urban, suburban and rural applications. Airspan delivers high-capacity, high-performance solutions that allow cost-effective, rapid deployment at scale.

Next-generation Airspan solutions will leverage ON Semiconductor’s QCS-AX Wi-Fi 6 family of chipsets. These products will maximize the benefits of the new Wi-Fi 6 standard including the additional spectrum in the 6 GHz band. The OFDMA-based 8x8 beamforming technology utilizing 160 MHz channels with modulation rates of 1024 QAM will significantly improve interference immunity, enabling higher-spectral efficiency and delivering multi-gigabit capacity.

“We are excited to expand our collaboration with ON Semiconductor to deliver Fixed Wireless Access/Backhaul and indoor/outdoor Wi-Fi Hotspots that offer significantly enhanced performance at lower cost,” said Eric Stonestrom, Airspan’s CEO.

“The FWA innovation has expanded Wi-Fi use case into outdoor space. By leveraging Wi-Fi 6 offload to LTE/5G networks, end consumers can expect fast and seamless connectivity. We are thrilled to continue working with Airspan to bring new connectivity to underserved markets,” said Irvind Ghai, VP Marketing, Quantenna Connectivity Solutions at ON Semiconductor.

FWA demands continue to advance where capacity and reliability are critical for day-to-day use in schools, hospitals, law enforcement, economic growth, etc. Airspan Networks is positioned to continue to address market needs and shape the networks of tomorrow.