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Technica USA, in partnership with ASMPT, hosted a successful Demo Days event this week at its San Jose facility.
Following Technica’s Tech Day event held on May 13–14, which featured ASMPT’s advanced large BGA placement solutions, the ASMPT support team returned to San Jose to provide customers with a more in-depth demonstration of the SIPLACE SX platform.
Many customers who were impressed by ASMPT’s latest placement technology advancements attended the follow-up event to gain a closer look at the capabilities of the SIPLACE SX and discuss their specific manufacturing challenges. Of special interest was the ability of the SIPLACE equipment to be able to place small components in very tight spacing at unusual angles, and the ability to handle very large and heavy BGAs with numerous quality control checks before and during the placement process.
“We were very pleased to host both global and privately held contract manufacturers during this follow-up event,” said Jason Perry, president of Technica USA. “The discussions extended well beyond large BGA placement and focused on a wide range of production challenges customers are facing with their current equipment. ASMPT’s deep understanding of these challenges allowed the team to demonstrate practical solutions that can help improve productivity, flexibility, and overall manufacturing performance.”
The event provided attendees with valuable hands-on access to ASMPT’s technology and an opportunity to engage directly with technical experts to explore solutions tailored to their production requirements.
The ASMPT support team is looking forward to returning to San Jose to join Technica in hosting the next ASMPT Demo Day Event in September. The Event will feature the SIPLACE CA2, a groundbreaking chip assembly and SMT placement solution with seamless integration of bare dies and SMT placement without special processes.
