Powering the Future: Why True Ceramic Circuits Are Not Just ‘Better PCBs’
Global Sourcing Spotlight: The Global Quality Gap—Why Consistency Wins the Contract
Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components
Test Research, Inc. (TRI), the leading Test and Inspection systems provider for the electronics manufacturing industry, is proud to present the new 3D solder paste inspection (SPI) solution TR7007D/Q Plus.
The TR7007D/Q Plus 3D SPI platform is equipped with an improved motion controller (EtherCat) and an enhanced 2D light module. The new motion controller achieves real-time measurements and processing on the fly while the new light module realizes higher uniformity inspection, less shadow, and improved imaging.
The TR7007D/Q Plus can accurately inspect low solder bridges and compensate board warpage for eliminating local PCB deformation. The TR7007D/Q Plus is equipped with up to four projectors to ensure a shadow-free inspection. The SPI solution eases data exchange between the production line and the MES of your choice to enable data traceability for the connected factory.
