Dynetics Awarded DARPA Air Combat Evolution (ACE) Phase 1
May 7, 2020 | Business WireEstimated reading time: 1 minute
Dynetics, Inc., a wholly owned subsidiary of Leidos, has been awarded Phase 1 of the Air Combat Evolution (ACE) program, Technical Area 3 (TA3), by the Defense Advanced Research Projects Agency's (DARPA) Strategic Technology Office (STO). ACE TA3, also known as Alpha Mosaic, is valued at $12.3 million.
The ACE program is using aerial dogfighting as the initial challenge scenario for implementing artificial intelligence (AI) into high-intensity air conflicts, which intends to increase warfighter trust in combat autonomy. Similar to how the United States military trains fighter pilots, ACE performers will work to increase trust in automated, within-visual-range, air-to-air dogfighting. As algorithms and tactics mature, so will the scenarios and adversarial capabilities.
During the 18-month Phase 1 award, Dynetics will leverage program advances in automated dogfighting to enable operational-level scenarios with a large number of heterogeneous aircraft. By improving the algorithms and tactics developed within ACE, TA3 will lay the groundwork for future live, campaign-level experimentation of manned and unmanned vehicles.
"The ACE program is inspiring on so many levels," said Tim Keeter, ACE program manager for Dynetics. "Our team brings novel solutions that have proven to be feasible and scalable to these challenging ACE objectives. These efforts will help DARPA and the U.S. military expand their advantage in the evolution of Mosaic warfare."
The program consists of three phases. Phase 1 begins research in a simulated environment. Phase 2 advances to a flight environment using unmanned air vehicles. Phase 3 includes a realistic, manned-flight environment involving complex human-machine collaboration.
"Our entry into Phase 1 of ACE represents years of relevant research within Dynetics and our team members that position us to do great things for our country," said Kevin Albarado, Dynetics' chief engineer. "Our scientists and engineers are eager to continue advancing these state-of-the-art AI applications to help our warfighters defend our nation."
Dynetics has formed an industry team representing best-in-class leadership to tackle these technological challenges, they include: Soar Technology, Inc. (SoarTech), InfoSciTex, and Intuitive Research & Technology Corporation (IRTC). The Dynetics team will leverage its experience of advancing second and third wave artificial intelligence and autonomy concepts. Many of these concepts are performed within the scope of other major DARPA programs.
Suggested Items
Simbe Partners with Plexus to Scale Manufacturing and Meet Global Retail Demand
05/08/2024 | Globe NewswireSimbe, the leading provider of Store Intelligence™ solutions that increase retailer performance through unprecedented visibility and insights, today announced a partnership with Plexus Corp. to bring its best-in-class retail robotics-as-a-service to market quickly and at global scale.
Micross, Sital Announce Global Manufacturing & Distribution Partnership
05/07/2024 | Micross Components, Inc.Micross Components, Inc., a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications, is pleased to announce our exclusive partnership with Sital Technology (sitaltech.com), the leader in MIL-STD-1553 IP cores, specializing in integrated FPGA solutions.
Real Time with… IPC APEX EXPO 2024: Innovative Lamination Technology
05/07/2024 | Real Time with...IPC APEX EXPOKevin Barrett of Insulectro and Victor Lazaro of Indubond discuss their companies' partnership, focusing on Indubond's innovative lamination technology that uses induction heating. They discuss the advantages of this technology over traditional methods, its benefits to customers, and the crucial role of automation in manufacturing.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
IDTechEx Discusses Low-Loss Materials: The Enabler of Future Connected Vehicles?
05/06/2024 | IDTechExFuture connected vehicles will offer future drivers a safer, smoother, and more convenient driving experience. Not only will drivers get access to more navigation and entertainment options, but they will also gain access to safety technologies that will potentially reduce accidents, improve congestion, and reduce emissions globally by allowing vehicle safety systems to communicate with each other and with city traffic infrastructure.