Dynetics Awarded DARPA Air Combat Evolution (ACE) Phase 1
May 7, 2020 | Business WireEstimated reading time: 1 minute
Dynetics, Inc., a wholly owned subsidiary of Leidos, has been awarded Phase 1 of the Air Combat Evolution (ACE) program, Technical Area 3 (TA3), by the Defense Advanced Research Projects Agency's (DARPA) Strategic Technology Office (STO). ACE TA3, also known as Alpha Mosaic, is valued at $12.3 million.
The ACE program is using aerial dogfighting as the initial challenge scenario for implementing artificial intelligence (AI) into high-intensity air conflicts, which intends to increase warfighter trust in combat autonomy. Similar to how the United States military trains fighter pilots, ACE performers will work to increase trust in automated, within-visual-range, air-to-air dogfighting. As algorithms and tactics mature, so will the scenarios and adversarial capabilities.
During the 18-month Phase 1 award, Dynetics will leverage program advances in automated dogfighting to enable operational-level scenarios with a large number of heterogeneous aircraft. By improving the algorithms and tactics developed within ACE, TA3 will lay the groundwork for future live, campaign-level experimentation of manned and unmanned vehicles.
"The ACE program is inspiring on so many levels," said Tim Keeter, ACE program manager for Dynetics. "Our team brings novel solutions that have proven to be feasible and scalable to these challenging ACE objectives. These efforts will help DARPA and the U.S. military expand their advantage in the evolution of Mosaic warfare."
The program consists of three phases. Phase 1 begins research in a simulated environment. Phase 2 advances to a flight environment using unmanned air vehicles. Phase 3 includes a realistic, manned-flight environment involving complex human-machine collaboration.
"Our entry into Phase 1 of ACE represents years of relevant research within Dynetics and our team members that position us to do great things for our country," said Kevin Albarado, Dynetics' chief engineer. "Our scientists and engineers are eager to continue advancing these state-of-the-art AI applications to help our warfighters defend our nation."
Dynetics has formed an industry team representing best-in-class leadership to tackle these technological challenges, they include: Soar Technology, Inc. (SoarTech), InfoSciTex, and Intuitive Research & Technology Corporation (IRTC). The Dynetics team will leverage its experience of advancing second and third wave artificial intelligence and autonomy concepts. Many of these concepts are performed within the scope of other major DARPA programs.
Suggested Items
Laser Photonics Propels R&D Efforts in Wafer Marking
02/04/2025 | BUSINESS WIRELaser Photonics Corporation, a leading global developer of industrial laser systems for cleaning and other material processing applications, and its recently acquired subsidiary, Control Micro Systems, Inc. (CMS Laser), announced the expansion of their Laser Wafer Marking technology research and development program.
EXTOLL Collaborates with BeammWave and GlobalFoundries as Key SerDes IP Partner for Lowest Power High-Speed ASIC
02/04/2025 | GlobalFoundriesEXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process technology, 22FDX®.
YINCAE Launches UF 120LA
02/04/2025 | YINCAEYINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.
EXTOLL Collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC
02/03/2025 | GlobalFoundriesEXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process technology, 22FDX®.
LITEON+, LITEON Startup Platform, Expands International Partner Ecosystem
02/03/2025 | LITEON TechnologyLITEON Technology announced that the "LITEON+ Startup Platform" has formed an alliance with "Plug and Play Japan," one of the world's largest accelerators/venture capitals. This collaboration focuses on the "Deep Tech" theme, leveraging each other's startup ecosystems to introduce teams specializing in energy, sustainability, and AI.