Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Major Suppliers in Electronics Assembly Materials Awarded U.S. Patent for Innolot/Loctite 90isc Alloy
May 13, 2020 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
Three major suppliers in electronics assembly materials, MacDermid Alpha Electronics Solutions, Henkel, and Heraeus, received notice that the United States Patent and Trademark Office has issued Patent No. US10376994B2 for their innovative solder alloy formulation marketed under the brand names Innolot (Heraeus & Alpha) and Loctite 90ISC (Henkel). The patent was granted an extended expiration to June 11, 2029.
The technology was developed in a cooperative project to produce a lead-free solder alloy specifically for harsh environment electronics applications. The result was an alloy with markedly improved reliability performance as compared to standard SAC alloys. Promoted in the electronics market for over ten years, the respective Innolot and Loctite 90ISC products are widely recognized as a high-reliability, thermal cycling, thermal ageing and vibration-resistant alloy, making it well suited for automotive applications and assemblies. The Innolot/90ISC alloy is designed to tolerate the demands of high-temperature applications while still being solderable at standard lead-free process temperatures.
The issuance of the U.S. patent is a further achievement for MacDermid Alpha, Henkel, and Heraeus and their efforts towards creating innovative materials for the challenges and demands of today’s electronics assembly. “The issuing of this patent is of strategic and commercial importance,” said Tom Hunsinger, Vice President of Marketing MacDermid Alpha Electronics Solutions, “Coupled with patent protection in Europe and Japan, this will help drive new business opportunities not only in automotive but in other markets with harsh environment challenges.”
MacDermid Alpha Electronics Solutions, Henkel, and Heraeus market Innolot and Loctite 90ISC products in a variety of forms including solder paste, bar solder, and wire. Patents are currently held in EU (EP1617968B1) and Japan (JP5320556B2).
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Kester, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.