Next Generation Jammer Low Band (NGJ-LB) Begins Final DET Tests
May 19, 2020 | U.S. NavyEstimated reading time: 1 minute
The U.S. Navy recently began the final Demonstration of Existing Technologies (DET) test period for the Next Generation Jammer Low Band (NGJ-LB) capability at Naval Air Station Patuxent River, Maryland.
Tests are being conducted at the Air Combat Environmental Test and Evaluation Facility and the Facility for Antenna and RCS Measurement (FARM) through this summer. The 20-month DET contract has been a collaborative effort with industry partners to assess technical maturity.
“This is an exciting time for the team,” said Airborne Electronic Attack Systems (PMA-234) Program Manager Capt. Michael Orr, who oversees the NGJ-LB program. “It’s the culmination of almost two years in the making. I’m very proud, despite the current CoVID-19 environment, that our collective government and industry teams continue to focus on delivering fleet capability while also maintaining health and safety protocol.”
Two DET contracts were awarded in October 2018 to Northrop Grumman Corporation and L3Harris, and since then, both companies completed eight significant test events, said NGJ-LB Deputy Program Manager Leon Smith.
NGJ-LB is part of a larger NGJ weapon system that will augment, and ultimately replace the legacy ALQ-99 Tactical Jamming System (TJS) currently used for Airborne Electronic Attack on the EA-18G Growler aircraft.
“NGJ-LB is the next step in the evolution of Airborne Electronic Attack that is needed to meet current and emerging electronic warfare gaps, and our team is dedicated to delivering this capability to the fleet as quickly as possible,” Orr said.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
SEMI Foundation Honors Applied Materials at SEMICON West with 2025 Excellence in Achievement Award for Talent Development
11/04/2025 | SEMIThe SEMI Foundation announced it recognized Applied Materials, Inc. with the Excellence in Achievement Award at SEMICON West 2025 in Phoenix, Arizona, honoring the company’s outstanding leadership and collaboration in building the next generation of semiconductor talent.
Update: Technica USA Begins Exclusive U.S. Distributor for DCT Cleaning Products
11/03/2025 | Technica USATechnica USA is pleased to announce they have begun shipping product for DCT USA, LLC today. Technica recently announced a strategic partnership as the exclusive master distributor of DCT cleaning products in the United States, which became effective November 1, 2025.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.