Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
CE3 Electronics Inc. Selects MIRTEC for Continuous Quality Improvement
May 22, 2020 | MirtecEstimated reading time: 2 minutes
MIRTEC, a ‘Leading Global Supplier’ of Technologically Advanced 3D Inspection Systems to the Electronics Manufacturing Industry, is pleased to announce that CE3 Electronics Inc., a World-Class EMS provider specializing in advanced printed circuit board assembly and complex cable and wire harness manufacturing, has selected MIRTEC as their 3D AOI partner with the purchase of an MV-6 OMNI 3D AOI Machine.
“CE3 Electronics Inc. is a World-Class Electronics Manufacturing Services provider specializing in advanced printed circuit board assembly and complex cable and wire harness manufacturing. Our company continually invests in state-of-the-art manufacturing equipment to ensure that our clients consistently receive the highest quality PCB assemblies. As part of our commitment to Continuous Quality Improvement, CE3 recently purchased a new MIRTEC MV-6 OMNI 3D AOI machine. I am pleased to report that our operators and inspectors are extremely impressed with the superior performance and accuracy of this system. MIRTEC’s revolutionary OMNI-VISION® 3D Inspection Technology drastically reduces the number of false calls and has enabled us to virtually eliminate visual solder inspection. The comprehensive SPC analysis software is easy to use and provides actionable process information to our quality personnel. CE3 would highly recommend MIRTEC to any company considering the purchase of a 3D AOI machine”, stated Shawn Aucoin, Engineering Manager, CE3 Electronics Inc.
“Electronic Manufacturers are becoming ever more selective in purchasing equipment that will add value to their business and provide them with a much-needed edge in this highly competitive industry,” said Brian D’Amico, President of MIRTEC Corp. “An overwhelming number of OEM and EMS providers are relying upon MIRTEC 3D Automated Optical Inspection (AOI) equipment to help increase profitability by improving production yields and reducing costly rework. We are extremely pleased to have been awarded CE3’s 3D AOI business. It is truly a pleasure to continue our long-standing partnership with the outstanding team at CE3.”
MIRTEC’s award-winning MV-6 OMNI 3D AOI Machines are configured with the company’s exclusive OMNI-VISION® 3D Inspection Technology which combines a 15 Mega Pixel CoaXPress Camera System with MIRTEC’s revolutionary Digital Tri-Frequency Moiré 3D Technology to provide precision inspection of SMT devices on finished PCB assemblies. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as 3D solder fillet inspection post reflow. Fully configured the MV-6 OMNI machine features four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel CoaXPress Top-Down Camera and an Eight (8) Phase COLOR Lighting System.
For further information about MIRTEC’s market leading inspection solutions, please visit www.mirtec.com.
Share on:
Suggested Items
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.