It’s Only Common Sense: Great Leaders Lead From the Front
Dan’s Biz Bookshelf: ‘The Talent Code: Greatness Isn’t Born. It’s Grown. Here’s How’
The Marketing Minute: Get Out of Your Lane—Electronics Marketing Needs Bold Moves
Elsyca Offers Free White Paper On How Plating Simulation Raises Yield and Profitability
May 26, 2020 | ElsycaEstimated reading time: Less than a minute
Problems with non-uniformity in PCB copper pattern plating are typically described as "the FAB problem". But imagine how much time and money one could save when each player in the process (Design -> CAM -> Production) would be able to identify potential problems at an early stage.
What if the PCB pre-production engineer could upfront identify problem areas for the pattern plating and apply auto-intelligent copper balancing, as part of the CAM process to provide a right-first-time panel layout for production? And what if the process engineer has a software that accurately predicted the impact of plating parameters on the layer thickness distribution to increase first pass yields on new PCB parts?
Check out Elsyca’s new white paper to learn more about how you can save time and money with production-proofing your PCB copper plating.
To download this white paper now, click here.
Be sure to check out one of Elsyca's informative webinars. For more information, click here.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Elephantech to Exhibit at Semicon Japan 2025
11/28/2025 | ElephantechFrom December 17–19, Elephantech will be exhibiting at Semicon Japan 2025 at Tokyo Big Sight.
Elephantech to Showcase Thick-Copper FPC and Ultra-Fine Copper Nanofiller at AABC 2025
11/26/2025 | ElephantechElephantech will be exhibiting at AABC 2025, held from December 9-11, in Las Vegas, USA.
Connect the Dots: The Future of Designing for Reality—Electroless Copper
11/26/2025 | Matt Stevenson -- Column: Connect the DotsOn a recent episode of I-Connect007’s On the Line With… podcast, we discussed electroless copper deposition—depositing a thin copper layer into the through-holes and vias of what will eventually become a printed circuit board. Specifically, it is a chemically catalyzed deposition of copper, mainly to the epoxy inside the holes (as well as on the entire surface of the board). Electroless differs from electrolytic in that electrolytic deposition relies on electricity.
NcodiN Secures €16M Seed Round to Break AI’s Main Bottleneck with the World’s Smallest Laser
11/21/2025 | BUSINESS WIRENcodiN, the deep-tech startup pioneering optical interposer technology with integrated nanolasers, has secured €16 million in oversubscribed Seed financing round.
Rubin’s Cableless Architecture and ASIC High-Layer HDI Designs Push PCBs to the Center of AI Compute Power
11/20/2025 | TrendForceTrendForce’s latest research points out that AI server design is undergoing a fundamental structural shift. From NVIDIA’s Rubin platform featuring a fully cableless architecture, to hyperscalers’ in-house ASIC servers adopting ultra-high-layer HDI designs, PCBs are no longer merely passive circuit carriers—they are becoming a core enabler of compute performance.