TSK Schill Demonstrates Sustainable Etching Process Solutions for the PCM Industry at PCMI Fall Conference 2025

Estimated reading time: 2 minutes

As Platinum Sponsor of the PCMI Fall Conference 2025, TSK Schill GmbH presented its latest technologies for optimising horizontal wet chemical etching processes for the PCM (Photochemical Machining) industry. A key element of the presentation was the strategic technology partnership with KSD Innovations, a specialist in chemical regeneration systems – although KSD itself was not present on site.

The close cooperation between the two companies enables a holistic process approach combining high-precision etching technology with advanced chemical regeneration, setting new benchmarks in efficiency, process stability and environmental performance for PCM production.

High-precision etching technology combined with partner system expertise

TSK showcased its advanced vacuum etching systems for horizontal wet processing lines, designed for photochemical machining of:

• Stainless steel
• High-performance alloys
• Copper and special metals
• Precision sheets and complex parts

These systems provide uniform wetting and homogeneous material removal, even for complex geometries and tight tolerances. In combination with KSD’s regeneration technologies, a fully integrated process concept is created, significantly improving both etching quality and the service life of process chemicals.

The partnership enables seamless integration of etching and regeneration technology – from material removal to continuous chemical treatment within a closed-loop system.

Synergy of etching and regeneration technology

A major focus of the presentation was the technological synergy between TSK’s equipment and KSD’s regeneration solutions. TSK demonstrated how modern regeneration systems – particularly in cooperation with KSD Innovations – can be integrated into existing PCM production lines to continuously regenerate etching chemicals and keep them within optimal process parameters.

Process control is handled via Siemens PLC-based systems continuously monitoring:

• Redox potential
• Density
• Conductivity
• pH value

This combination of TSK’s precision machinery and KSD’s regeneration expertise creates a stable, reproducible process environment with high system availability and consistent output quality.

Sustainable process partnership as a competitive advantage

The integrated TSK-KSD process concept allows PCM manufacturers to:

• Significantly reduce chemical consumption
• Extend process media lifetime
• Minimise disposal costs
• Improve process stability and repeatability

This strong partnership-driven solution enables manufacturers to enhance productivity while achieving measurable improvements in sustainability and cost efficiency – a decisive competitive advantage in high-precision PCM markets.

Global partnership – local implementation

While TSK continues to expand its global presence with production and service locations across Europe, Asia and the USA, KSD complements this structure with decades of experience in developing and implementing regeneration systems for photochemical etching processes.

Together, both companies pursue the shared goal of delivering integrated, future-oriented solutions for efficient, environmentally responsible PCM manufacturing worldwide.

Conclusion

With its presentation at the PCMI Fall Conference 2025, TSK Schill GmbH – together with its technology partner KSD Innovations – once again underlined its position as a key driver of sustainable process solutions within the PCM industry. The showcased partnership clearly demonstrates how coordinated system integration sets new standards for efficiency, process reliability and environmental responsibility.