Dan’s Biz Bookshelf: ‘The Next RenAIssance: AI and the Expansion of Human Potential’
The Chemical Connection: When the Industry Moves Faster Than the Standards
Driving Innovation: Selecting the Right Laser Source
Schweizer Electronic AG: Production Starts at the New Location in China
May 26, 2020 | Schweizer Electronic AGEstimated reading time: 1 minute
After a construction period of one and a half years, production started at the new high-tech printed circuit board plant in Jiangsu, China, a few days ago. SCHWEIZER has invested around EUR 100 million in the new facility to date. Once the final expansion stage has been completed, the plant will have a capacity of over 7,000 square metres per day, which is roughly five times that of the German plant.
ISO 9001 certification has already been successfully concluded. "Customers who have been able to visit the plant so far were really impressed by the integrated production concept", reports Alfred Pang, Managing Director in China and long-standing member of staff at SCHWEIZER
The unique German-Chinese set-up now enables SCHWEIZER to provide technology products at competitive prices in the highest quality. Linking the largest European PCB production factory, in Schramberg, Germany, and the new plant in China will ensure the highest level of delivery security for the supply chain stability of customers in Europe.
With its Chinese location, SCHWEIZER is opening up access to new markets and customer groups and is able to provide a complete range of PCB technologies, ranging from simple multilayer circuit boards to future-oriented chip embedding technology from both production plants. Today, we are a recognised technology partner for the European automotive industry. China will now enable us to present our expertise to a much broader customer base. In addition to its own sales teams in Europe and China, SCHWEIZER has also set up distribution partnerships in North America and Japan, with Korea to follow very soon.
The Jintan plant, located in Jiangsu province about 200 km east of Shanghai, is equipped with the latest plant technologies and is unique in its high level of machine integration and automation. The entire production process fulfils the stringent requirements for a chip embedding company with regard to cleanliness and electrostatic shielding. An experienced team of staff from China, Germany, Singapore and Taiwan, some of whom have been employed by SCHWEIZER for many years, guarantees our company maxim: One company – One Team – One Quality.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Everspin Executes $40M Agreement for Mil-Aero MRAM Applications
04/30/2026 | Everspin Technologies, Inc.Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.
Swinburne University, Siemens Launch Australia’s First Quantum Timing Study for Smarter Power Grids
04/30/2026 | SiemensSwinburne University of Technology and Siemens are undertaking first-of-its-kind research in Australia, into how quantum-enhanced timing can help future-proof the energy grid and increase grid stability.
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.
OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment
04/29/2026 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.
ASC’s John Johnson Bullish on the U.S. and High-tech PCBs
04/28/2026 | Marcy LaRont, I-Connect007It was a good couple of days at the SMTA UHDI Symposium in Avondale, Arizona, in early April, where John Johnson, head of technology at American Standard Circuits (ASC) and resident PCB expert on UHDI in the real-world of manufacturing, was a presenter. As the symposium ended, I visited with John, who reflected on what he considered most important and what had made the greatest impression on him.