Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Indium Introduces New ROL0 and Halogen-free Flux-cored Wire

12/11/2024 | Indium Corporation
Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.

SolderKing Celebrates a Year of Expansion, Innovation, and Sustainability Achievements

12/09/2024 | SolderKing Assembly Materials Ltd,
SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, has wrapped up 2024 with a series of milestones that reflect its ongoing growth and commitment to innovation.

ViTrox Expands Midwest Reach with ASC International as New Sales Channel Partner

12/09/2024 | SMTA
ViTrox Americas Inc. is pleased to announce ASC International as its new Sales Channel Partner and Manufacturers’ Representative for Minnesota, North Dakota and South Dakota.

ASMPT: Innovative Bonding for Power Electronics

12/09/2024 | ASMPT
ASMPT presents with its SilverSAM™ SilverSAM machine a highlight for makers of modern power electronics: an innovative and versatile silver sintering machine that meets the great demands on bonding, which is particularly critical in the field of electromobility. SilverSAM sets new standards in interconnect technology for power electronics, particularly in the rapidly growing electric vehicle market.

HyRel Announces Sale of First Versacell Robotic System to Leading Defense Contractor

12/03/2024 | HyRel
HyRel Technologies, a global provider of quick-turn semiconductor modification solutions, is proud to announce the sale of its first Versacell Robotic Solder Dip & BGA Reballing System to one of the top five defense contractors. Originally developed for internal use, the revolutionary Versacell System drew the attention of the contractor, who recognized its impressive precision, accuracy, and efficiency.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in