-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Indium Corporation President to Speak at Workforce and Education Conference
June 5, 2020 | Indium CorporationEstimated reading time: 2 minutes
Indium Corporation’s Ross Berntson, President and COO, will be one of the featured speakers at Jobs for the Future (JFF) Horizons virtual conference at 3 p.m. EST (2 p.m. CST), Tuesday, June 9.
Drawing from his unique global manufacturing experience, Berntson will participate in the session Responding to Crisis and Preparing for the Future: Regional Manufacturing Perspectives. In this session, Berntson and co-speakers will provide regional perspectives on how COVID-19 has impacted their industry in some unprecedented ways, as well as how manufacturers are planning for future recovery.
Part of Indium Corporation’s response to COVID-19, which has been designed to keep employees safe and the factories running, was derived from the creation of a manufacturer’s pledge. Created in coordination with the Manufacturers Association of Central New York (MACNY), who will also present at the Horizons conference, the pledge is designed to utilize collective skills and knowledge, as well as best practices from noted authorities to help manufacturers make decisions that would allow them to keep employees safe and the factories running. To learn more, visit here. MACNY’s pledge page can be found at https://www.macny.org/keep-people-safe-and-factories-running/.
Berntson is responsible for Indium Corporation’s global sales, marketing, technical support, operations, engineering, human resources, and product R&D functions.
Berntson joined Indium Corporation in 1996 as a Product Specialist. He quickly rose to the roles of Product Manager, Marketing Leader, Sales Leader, and Tech Support Leader. Prior to his current role, he served as Executive Vice President and President of Indium Corporation’s Asia Holdings. Berntson lived in Singapore for two years, learning much about the daily activities in Southeast Asia and China. While there, he expanded his understanding of the regional business needs and opportunities for Indium Corporation. Berntson has been instrumental in forging new marketing strategies and providing expanded sales opportunities for Indium Corporation’s full line of solder products. He is an active member of numerous industry organizations, including the IPC, iNEMI, IMAPS, and SMTA. He has published several technical papers and articles and has presented at technical conferences globally. Berntson has a master’s degree in Business Administration and a bachelor’s degree in Chemistry from Cornell University, where he earned the Henny Wittink Memorial Marketing Prize and the George Caldwell Award.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.