-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Seika Machinery Hosts Summer Sale on Select Products
June 8, 2020 | Seika Machinery, Inc.Estimated reading time: 1 minute

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces a special summer sale on select products. Significant savings are available for McDry cabinets, Sawa stencil cleaners, Sayaka PCB routers, Malcom viscometers, paste mixers and profiler systems while stock lasts.
McDry Dry Cabinets provide optimal ultra-low humidity and moisture-proof storage for IC packages. Moisture-sensitive components when safely and properly stored in McDry have an indefinite floor-life and micro-cracking or pop-corning during the reflow process is not an issue. McDry cabinets conform to IPC/JEDEC J-STD 033D and IPC 1601 Guidelines.
Sawa Stencil Cleaners are widely used globally to ensure high yields when screen printing solder paste onto printed circuit boards. Normal cloth wipe cleaning of stencils cannot completely remove solder paste especially in fine pitch applications as a small amount of solder balls have a tendency to adhere in the corners of the apertures.
Sayaka PCB Routers provide stress-free depanelization along with a fixture-based highly efficient dust vacuum system. In addition to clean and precise depanelization for densely populated PCBs, the router features easy, advanced image-processing software with point-and-click operation for programming router paths.
The MALCOM RCX Series Modular Reflow Oven Profiling System offers complete profiling of reflow ovens, including oven temperature, video imaging, O2 concentration and convection air velocity. It verifies that ovens are performing at optimal conditions, and enables users to troubleshoot problem areas.
The PCU-285 Spiral Viscometer is designed to measure solder paste viscosity. It offers new functions that make it possible to create, execute and store measurement programs with or without a PC. The system uses a touch panel display for improved functionality and visibility.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.