Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
SMT Northwest Partners with MIRTEC to Maintain High-Quality Production Standards
June 8, 2020 | MirtecEstimated reading time: 1 minute
MIRTEC, a “Leading Global Supplier” of Technologically Advanced 3D Inspection Systems to the Electronics Manufacturing Industry, is pleased to announce that SMT Northwest, Inc., a highly regarded EMS provider specializing in high-mix/low-volume, quick turn printed circuit board assembly, has selected MIRTEC as their 3D AOI partner with the purchase of an MV-3 OMNI Desktop 3D AOI Machine.
“SMT Northwest has been providing state-of-the-art Electronic Manufacturing Services since 1996 and has earned a solid reputation as a cornerstone in the Pacific Northwest. Our company provides a wide range of products and services to some of the most demanding markets. For over a decade, SMTNW has relied upon MIRTEC inspection equipment to maintain our high-quality production standards. We recently purchased a new MIRTEC MV-3 OMNI Desktop 3D AOI machine. The superior performance of this system has allowed us to process higher production volumes and meet the exacting level of quality that is expected by the Power and Defense Industries. MIRTEC’s exceptional products combined with their fantastic support have made them a valuable business partner throughout the years.” Angela Stalker - Quality Manager, SMT Northwest, Inc.
“It is truly a pleasure to continue our long-standing partnership with SMT Northwest,” said Brian D’Amico, President of MIRTEC Corp. “We at MIRTEC are committed to continuous improvement through innovation and strong quality leadership. Ours is a business of precision and accuracy, reproducibility and specificity, timeliness and trust. These are the real products and services which we provide to our valued customers. We look forward to our continued partnership and the mutual success of our two organizations.”
MIRTEC’s award-winning MV-3 OMNI Desktop 3D AOI Machines are configured with the company’s exclusive OMNI-VISION® 3D Inspection Technology which combines a 15 Mega Pixel CoaXPress Camera System with MIRTEC’s revolutionary Digital Tri-Frequency Moiré 3D Technology to provide precision inspection of SMT devices on finished PCB assemblies. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as 3D solder fillet inspection post reflow. Fully configured the MV-3 OMNI machines feature four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel CoaXPress Top-Down Camera and an Eight (8) Phase COLOR Lighting System.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.