Learning With Leo: What Is the Cost of Quality Brought About by Training?
Nolan’s Notes: A Tribute to Iola—and Automation
Knocking Down the Bone Pile: Solderability Test Methods, Myths, and Realities
Indium Corporation Expert to Present at ICEPT
June 10, 2020 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will share his industry expertise during the 21st International Conference on Electronic Packaging Technology (ICEPT), Aug. 12-15 in Guangzhou, China.
The demand for faster, more powerful devices in the electronics industry makes thermal management a high priority as the need for improved high-performance materials continues to grow. While common thermal interface material (TIM) solutions like thermal grease, thermal gel, solder preforms, and liquid solder all have their own benefits, they can also be subject to common reliability issues like outgassing, voiding, and pump-out. In Versatile TIM Solution with Chain Network Solder Composite, Dr. Lee examines the development of a novel TIM solution with a high-melting Cu chain network that prevents these defects.
Dr. Lee has been with Indium Corporation since 1986. He has more than three decades of experience in the development of fluxes, alloys, and solder pastes for SMT industries. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermally conductive materials. Dr. Lee has been recognized by numerous industry organizations for his research, including SMTA, IEEE, and CPMT. Dr. Lee has published articles in numerous industry publications and is frequently an invited speaker for presentations, seminars, keynote speeches, and short courses worldwide, many of which have been recognized with “Best of Conference” awards.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Nolan’s Notes: A Tribute to Iola—and Automation
12/02/2025 | Nolan Johnson -- Column: Nolan's NotesIn the 1960s and ’70s, when the west side of the Portland, Oregon, metro area was dominated by Tektronix, my grandmother worked as one of the “assembly ladies.” Known as “Tek,” the company was an economic juggernaut, driving the economy of the cities of Beaverton, Tigard, and Hillsboro. The only employer larger than Tektronix was the state of Oregon itself; virtually every Portlander had some connection to Tek.
Indium Expert to Tackle Reliability Challenges in AI and High-Performance Computing at EPTC 2025
11/27/2025 | Indium CorporationIndium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will be held December 2-5, 2025, in Singapore.
Altus Supports Concurrent Technologies’ Production Expansion with Advanced Inline Vapour Phase System
11/26/2025 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry, has successfully supplied Concurrent Technologies Plc (Concurrent), a designer and manufacturer of mission-critical embedded computing solutions, with their second ASSCON vapour phase soldering system, the innovative VP2100-100 inline unit.
Knocking Down the Bone Pile: Solderability Test Methods, Myths, and Realities
11/26/2025 | Nash Bell -- Column: Knocking Down the Bone PileSolderability testing answers a simple question: How readily will a termination form a sound solder joint under defined conditions? It is not component preconditioning. Rather, it evaluates wetting—the speed and extent to which molten solder spreads and adheres to a surface—using controlled methods (e.g., visual “dip-and-look” or wetting-balance measurements). Results reflect the combined effects of termination finish, storage and handling, flux activity, and the solder alloy in use.
Indium Experts to Present on Power Electronics at productronica 2025
11/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics during Productronica, November 18-21, in Munich, Germany.