NextFlex Secures Seven Years of Funding in Cost-Sharing Agreement with Air Force Research Laboratory

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NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Innovation Institute, announced that it has secured seven years of government funding worth up to $154M in a cost-sharing agreement with the Air Force Research Laboratory (AFRL).

The seven-year agreement also includes funding from the Office of the Secretary of Defense’s (OSD) Manufacturing Technology program, which focuses on cross-cutting defense manufacturing needs.

The funds will be used to directly support NextFlex’s ongoing mission to drive manufacturing technology needs for OSD Research & Engineering modernization priorities and developing FHE innovations to accelerate its adoption in the US, with particular focus given to Department of Defense technology transitions that increase military capabilities, and on developing a robust FHE workforce.

“We’re beginning to see some of the initial projects we’ve collaborated on with our members make great strides towards the market, or towards active military use,” explains NextFlex Executive Director Dr. Malcolm Thompson. “As the leading member organization and collaboration partner in the field of FHE, we know this new funding will pave the way towards the vision of Electronics Everywhere.”

Under the new Cooperative Agreement, NextFlex will update and extend its project support and technology roadmaps into FHE manufacturing in partnership with DoD and other government agencies to achieve specific goals in support of these agencies’ missions. With the additional funding, the Institute will also be able to expand on the number of FHE projects with its member partners and continue building a more robust FHE ecosystem in the US.

“We are excited to continue our partnership with NextFlex and its members. The Flexible Hybrid Electronic manufacturing ecosystem did not exist five years ago,” said Dr. Richard Vaia, Chief Scientist for the Materials and Manufacturing Directorate at AFRL. “Today these technologies are not only providing component solutions to our current platforms but are revolutionizing our design concepts for future transformation capabilities for 2030.“