-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
TQM: The Tyranny of the Urgent
June 10, 2020 | I-Connect007 Editorial TeamEstimated reading time: 2 minutes

The I-Connect007 editorial team recently spoke with Dr. Ron Lasky about what’s stopping companies from improving their processes, especially regarding productivity.
Nolan Johnson: Ron, thanks for joining us in this conversation. What’s your role in the industry?
Dr. Ron Lasky: My day job is as a professor of engineering at Dartmouth, and I also work with Indium Corporation as a senior technologist.
Barry Matties: What do you teach?
Lasky: I teach engineering statistics, optimization, technical project management, and topics in manufacturing and design. At Dartmouth, we have a program called a Master of Engineering Management (MEM). It’s a graduate program for students that are engineers but would like to get into management. Most of the courses I teach are in this program. Half of the MEM program is taught by the MBA Tuck School of Management, and the other half is taught by the engineering department. The topics that I focus on—and I have an additional program at Dartmouth on this—are Lean Six Sigma topics like process optimization, design of experiments, and statistical process control. In my class on topics in manufacturing and design, I focus on one manufacturing process mostly, and that’s electronic assembly because that’s what I know the best.
The optimization work I do is quite general; it’s not specific to solder paste or electronic assembly. Our Lean Six Sigma program at Dartmouth has become quite successful; since Dartmouth is part of the Ivy league, people like the fact that they get a certificate in a yellow belt through master black belt that was granted by the school of engineering at Dartmouth College, but it isn’t specific to electronic assembly.
Matties: This is an industry that has complained—especially on the bare board side— that there’s no profit left, and we’re making the argument that there’s plenty of profit; you’re spending your profit on a lot of waste in your process.
Lasky: I can definitely address that. That’s something I teach. I’ve been kind of frustrated in that if I propose a paper on how to minimize defects in voiding, I will get all sorts of interest, but if I propose a paper on how to improve productivity, there’s not as much interest. That baffles me because when I go and do audits, most of the places could make a lot more money if they implemented some common-sense improvements in productivity.
To read this entire interview, which appeared in the June 2020 issue of SMT007 Magazine, click here.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.