The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
Qualcomm Announces First 5G Snapdragon 6-Series Mobile Platform
June 18, 2020 | Qualcomm Technologies, Inc.Estimated reading time: 2 minutes
Qualcomm Technologies, Inc. announced its first 5G mobile platform in the 6-series, the Qualcomm® Snapdragon™ 690 5G Mobile Platform. This new platform is designed to make 5G user experiences even more broadly available around the world.
Snapdragon 690 also supports remarkable on-device AI and vibrant entertainment experiences. HMD Global, LG Electronics, Motorola, SHARP, TCL, and Wingtech are among the OEMs/ODMs expected to announce smartphones powered by Snapdragon 690.
“With over 375 5G designs launched or in development to date using Qualcomm Technologies’ 5G solutions, we are driving the proliferation of 5G across multiple tiers to make the next generation of camera, artificial intelligence, and gaming experiences more broadly available,” said Cristiano Amon, president, Qualcomm Incorporated. “Driving the expansion of 5G into the Snapdragon 6-series has the potential to make 5G accessible to more than 2 billion smartphone users around the world.”
The Snapdragon 690 brings many of the most in-demand premium mobile experiences to the 6 series for the first time including 4K HDR (true 10-bit) support to capture over a billion shades of color and snapshots at up to 192 Megapixels. It also supports 120hz displays for fast refresh rates and smooth UI experiences.
Plus, 5G connectivity gives gamers superior access to cloudbased, multi-player games virtually anytime, anywhere. Snapdragon 690 is equipped with the latest 5th generation Qualcomm® AI Engine, enabling smart camera and video, voice translation, advanced AI based imaging, and AI enhanced gaming experiences. Additionally, Snapdragon 690 features a Qualcomm® Kryo™ 560 CPU that delivers up to 20% performance improvement compared to its predecessor. The new Snapdragon X51 5G Modem-RF System is optimized for the 6-series platform to bring multi-gigabit speeds and superior 5G coverage to the 6-series for the first time.
“Just like the Android experience on our Nokia smartphones, our take on 5G is also future proofed. Earlier this year, we were the first manufacturer to leverage the power of the Qualcomm Snapdragon 765G 5G Modular Platform in a smartphone, delivering on our vision of a truly future-proof global 5G experience with the Nokia 8.3 5G,” said Juho Sarvikas, chief product officer, HMD Global. “Now with the Snapdragon 690 Mobile Platform, we are excited that our vision of future-proof 5G and global 5G roaming can be made more accessible to even more fans of Nokia phones. You can expect 5G worthy experiences powered by our PureDisplay and ZEISS Imaging innovation, now at an even more affordable price. We can’t wait to share more details on this exciting product with you, stay tuned.”
Devices based on Snapdragon 690 are expected to be commercially available in the second half of 2020.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
MEMS & Imaging Sensors Summit to Spotlight Sensing Revolution for Europe’s Leadership
09/11/2025 | SEMIIndustry experts will gather November 19-20 at the SEMI MEMS & Imaging Sensors Summit 2025 to explore the latest breakthroughs in AI-driven MEMS and imaging optimization, AR/VR technologies, and advanced sensor solutions for critical defence applications.
Direct Imaging System Market Size to Hit $4.30B by 2032, Driven by Increasing Demand for High-Precision PCB Manufacturing
09/11/2025 | Globe NewswireAccording to the SNS Insider, “The Direct Imaging System Market size was valued at $2.21 Billion in 2024 and is projected to reach $4.30 Billion by 2032, growing at a CAGR of 8.68% during 2025-2032.”
I-Connect007’s Editor’s Choice: Five Must-Reads for the Week
07/04/2025 | Marcy LaRont, I-Connect007For our industry, we have seen several bullish market announcements over the past few weeks, including one this week by IDC on the massive growth in the global server market. We’re also closely watching global trade and nearshoring. One good example of successful nearshoring is Rehm Thermal Systems, which celebrates its 10th anniversary in Mexico and the official opening of its new building in Guadalajara.
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.