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Indium Corporation Introduces Ultra-Thin Precision AuSn Preform
June 23, 2020 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation has expanded its portfolio of precision preforms with an ultra-thin AuSn preform designed for semiconductor laser applications, where thermal management has become a challenge.
Indium Corporation’s AuLTRA® ThInFORMS™ are 0.00035-thick (0.00889mm- or 8.89?m-) 80Au20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA® ThInFORMS™ help combat common issues, such as:
- Shorting—reduced solder volume inhibits wicking up the die, minimizing the risk of shorting
- Poor thermal transfer—the ultra-thin 0.00035” preform reduces bond-line thickness (BLT), thus improving thermal transfer and increasing the longevity and performance of the device.
For more information about Indium Corporation’s precision gold products, visit www.indium.com/gold.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
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