Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Atg Launches Latest Large Format Test System, A9XL, with 8 Heads and 48” x 26” Panel Capability

08/01/2025 | atg Luther & Maelzer GmbH
atg Luther & Maelzer GmbH (a Mycronic company) is proud to roll out a new large format test system generation based on the latest high speed atg A9 (board size up to 24” x 21”) and A9L platform.

Advint and Sayron Bring Advanced Rectifier Solutions to High-Reliability PCB Manufacturers

08/01/2025 | Advint Incorporated
Advint Incorporated has partnered with Sayron, a leading global rectifier manufacturer, to supply cutting-edge IGBT-based DC rectifiers to high-performance PCB manufacturers across North America and beyond. Sayron’s precision-engineered rectifiers align with the stringent requirements of advanced PCB processes.

Direct Metallization: A Sustainable Shift in PCB Fabrication

07/31/2025 | Jim Watkowski, Harry Yang, and Mark Edwards, MacDermid Alpha Electronics Solutions
The global electronics industry is undergoing a significant transformation, driven by the need for more resilient supply chains and environmentally sustainable manufacturing practices. Printed circuit boards (PCBs), the backbone of interconnection for electronic devices, are at the center of this shift. Traditionally, PCB fabrication has relied heavily on electroless copper, a process that, while effective, is resource-intensive and environmentally hazardous. In response, many manufacturers are turning to direct metallization technologies as a cleaner, more efficient alternative.

MacDermid Alpha Electronics Solutions Unveils Unified Global Website to Deepen Customer, Talent, and Stakeholder Engagement

07/31/2025 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions, the electronics business of Elements Solutions Inc, today launched macdermidalpha.com - a unified global website built to deepen digital engagement. The launch marks a significant milestone in the business’ ongoing commitment to delivering more meaningful, interactive, and impactful experiences for its customers, talent, and stakeholders worldwide. 

Solving the Toughest BGA Challenges in Electronics

07/30/2025 | Nash Bell, BEST Inc.
Since the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for electronic devices. Compared with high-density ultra-fine pitch quad flat packs (QFPs), BGA packages significantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in