The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Solving the Toughest BGA Challenges in Electronics
July 30, 2025 | Nash Bell, BEST Inc.Estimated reading time: Less than a minute
Since the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for electronic devices. Compared with high-density ultra-fine pitch quad flat packs (QFPs), BGA packages significantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%.
Integrating standard BGAs and their stacked counterpart, package-on-package (PoP), can further increase density, facilitating greater design flexibility for compact and efficient circuit designs in applications ranging from consumer electronics to automotive systems and medical devices. Despite these advantages, the complexity of BGA packages introduces challenges during rework, requiring innovative methods and thorough inspection practices to maintain performance and reliability.
BGA rework involves removing and replacing BGA packages on printed circuit boards because of defects, upgrades, and/or failures (Figure 1). This process is vital for ensuring the integrity and functionality of electronic devices. Engineers employ several techniques, each offering distinct advantages and requiring careful consideration based on specific applications.
To continue reading this article, which originally appeared in the July 2025 edition of SMT007 Magazine, click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
IPC Releases Latest Standards and Revisions Updates
06/05/2025 | IPCEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.
When Small Just Isn’t Small Enough; INSPECTIS Launches Micro Size Optical Probe Tip for BGA Inspection
06/03/2025 | INSPECTISThe Inspectis BGA inspection system now offers the tiniest optical probe, the Micro Size Optical Probe Tip, for users who feel that they need to get ‘really small’.
BEST Inc. Offers Complete Portfolio of Electronic Component Salvaging Services
05/12/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they offer a complete range of electronic component salvaging services. With more than 20 years of BGA salvaging experience, BEST has the knowledge, skills, and proper equipment to reliably remove and prepare components for later use in the assembly of printed circuit boards.
LG Innotek to Build FC-BGA into 700 Million USD Business with State-of-the-art Dream Factory
05/01/2025 | PR NewswireLG unveiled the Dream Factory, a hub for the production of FC-BGAs (Flip Chip Ball Grid Arrays), the company's next-generation growth engine, to the media for the first time and announced it on the 30th April.