Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Dymax Introduces Multi-Cure 9037-F Encapsulant for Printed Circuit Board Assembly
July 9, 2020 | Globe NewswireEstimated reading time: Less than a minute
Dymax Corporation expands its range of encapsulant materials with the introduction of Multi-Cure® 9037-F. The product cures in seconds upon exposure to UV/Visible light and has secondary heat cure for shadow areas caused by high-profile components on printed circuit boards.
The material features improved flexibility and resiliency for a variety of glob-top, chip-on-board, chip-on-flex, chip-on-glass, and wire-tacking/bonding applications. It is well-suited for encapsulation of critical components on flexible and rigid circuit board materials such as FR-4, Kapton®, and glass, and contains no sharp, abrasive, mineral, or glass fillers to abrade fine wires.
Multi-Cure 9037-F has excellent moisture and thermal resistance, making it a good candidate for use as a corrosion guard for wire-bond connections in battery management systems. Additional uses include encapsulation of components on circuit boards found in automotive ADAS and infotainment systems, aerospace and defense applications, and consumer electronics. Formulated with blue fluorescing technology, the material is highly visible on encapsulated PCB modules when exposed to low-intensity black light for easy visual quality inspection.
Share on:
Suggested Items
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
Kitron: Q1 2025 - Strong Start to the Year
04/25/2025 | KitronKitron reported first-quarter results characterised by continued momentum in the Defence & Aerospace market sector and a growing order backlog.
RTX's Collins Aerospace Enhances Capabilities to Speed Marine Corps Decision-making in Battle
04/22/2025 | RTXCollins Aerospace, an RTX business, successfully demonstrated new technology that helps the military gather and use information from a wider range of sources at Project Convergence Capstone 5, a large-scale military exercise.
AdvancedPCB Appoints Gary Stoffer as Chief Commercial Officer
04/18/2025 | PRNewswireAdvancedPCB is proud to announce the appointment of Gary Stoffer as its new Chief Commercial Officer (CCO). In this role, Stoffer will lead all sales, marketing, and commercial strategy initiatives as the company continues its mission to deliver cutting-edge PCB solutions to industries worldwide.
Real Time with... IPC APEX EXPO 2025: GreenSource's Growth and Future Developments
04/15/2025 | Real Time with...IPC APEX EXPOThings are looking bright for GreenSource. Michael Gleason shares an update on GreenSource's recent growth and upcoming changes. A recipient of a Defense Production Act Investment Program award, GreenSource is planning for new substrate capabilities. Current investments continue to enhance equipment and sustainability initiatives such as water quality. And their unique collaboration with the University of New Hampshire continues to aid their workforce development, despite recruitment challenges.