Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Taiyo America Announces New Technical Sales Engineer
July 9, 2020 | Taiyo AmericaEstimated reading time: 1 minute
Taiyo America, Inc. is pleased to announce Kate Han as technical sales engineer for the Western Region of the United States, effective July 1, 2020.
Han worked as a sales professional for seven years. She is joining Taiyo after working at Microcraft for the past year promoting inkjet solder mask technology. Microcraft specializes in the development, design, manufacture, and sale of printed circuit board testers and inkjet printers.
She is fluent in Korean, Chinese, Japanese and English. She enjoys traveling and reading in her free time.
“We are excited to add Kate to our Taiyo team. She brings international business experience as well as inkjet knowledge to Taiyo America,” says Zach Maekawa, president of Taiyo America.
“I look forward to working with the Taiyo team and supporting our customers in the West,” said Han.
John Fix, director of sales and marketing, added, “Working in the Western region with Brian Wojtkiewicz, Kate will enhance our communications with other Taiyo group companies with her multilingual skills. Her inkjet experience will also be very valuable to Taiyo America and our customer base as this technology continues to grow.”
Please welcome Kate Han to the Taiyo team.
About Taiyo America, Inc.
Established 30 years ago TAIYO AMERICA, INC. is a subsidiary of TAIYO HOLDINGS CO., LTD., the world's leading manufacturer of specialty inks and solder masks for printed circuit boards. Taiyo offers conductive inks and thermal management products for manufacturing printed electronics, lighting & displays, automotive, aerospace and other applications. For more information, visit www.taiyo-america.com.
Share on:
Suggested Items
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.