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Insituware Updates Website to Keep Pace With New Growth and Developments
July 22, 2020 | Insituware LLCEstimated reading time: 1 minute
Insituware LLC, the provider of the first smart in situ measurement solution with integrated machine learning technology, today announced its newly updated website. The new site has been completely updated and can be viewed at: insituware.com.
Insituware continues growing and developing new integrations for the Vision MARK-1 to enable the functionality of nonintrusive sensing for new industries, and has updated its website to reflect this. Insituware’s mission is to help customers take control of materials to save money, mitigate liability and gain a competitive edge.
Resources have been added for Insituware’s solutions for materials control, including solder paste and custom solutions. Solutions for conformal coatings to measure coating consistency and protect assemblies are coming soon. Contacts for Insituware’s distributor network in each territory are now available on the site, as well as the company’s extensive team.
Insituware’s Vision product family uses machine learning technology to bring material control solutions right in your hand. The Vision product family is built to last with expandable modules called 'Insights' for a futureproof design, continuously expanding functionality. The first Insight module will allow full monitoring and control of solder paste. This innovative tool will enable rapid, real-time inspection, diagnostics and process control capabilities.
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Sweeney Ng - CEE PCBSuggested Items
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Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation
04/14/2026 | Marcy LaRont, I-Connect007The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.