Tianma Orders Kateeva Yieldjet Inkjet Printing System for OLED Display R&D
July 30, 2020 | Globe NewswireEstimated reading time: 2 minutes
Kateeva reporta that Tianma Microelectronics Co., Ltd. has ordered a YIELDjet™ EXPLORE inkjet printing system to expand its research and development (R&D) programs for next-generation OLED displays. China-based Tianma is a leading manufacturer of displays used in smartphones, tablet PCs, medical instruments, and more. The company already uses Kateeva’s YIELDjet FLEX tools to mass-produce mobile OLED displays. The new system, which is built for 200mm glass substrates, will be used to develop devices and materials for various new mobile device applications. The tool will be shipped to the customer’s Shanghai facility later this year.
The installation will bring the number of Kateeva printers at customer sites to 60, making it the world’s largest installed base of inkjet tools mass producing OLED applications.
Kateeva developed the YIELDjet EXPLORE tool at its Silicon Valley innovation center to give display leaders a proven system to develop new OLED devices, evaluate advanced materials, and pilot new processes. The EXPLORE product is based on Kateeva’s YIELDjet platform – the world’s first inkjet manufacturing equipment solution built from the ground up to produce OLED displays in high volume. The first product to emerge from the platform was the YIELDjet FLEX system. It is the market leader for flexible OLED mass production. Since its introduction in 2014, the system has been used to manufacture more than 500M display panels in fabs throughout Asia. Today, the vast majority of high-end mobile phones feature displays that are produced by Kateeva tools.
An executive spokesperson at Tianma called Kateeva a valued technology partner and noted, “Tianma continues to benefit from the company’s innovative inkjet equipment solutions, as well as the team’s broad expertise.”
“Tianma is known for integrating industry-leading technologies into their mass-production lines as they relentlessly innovate new displays,” said Kateeva’s CEO, May Su. “The EXPLORE system lets them stretch their innovation aspirations and evaluate the myriad ways their future OLED mass-production processes can benefit from a proven inkjet deposition solution. We’re proud that our technology continues to enable their roadmap.”
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Kymeta Joins Red Cat Initiative for Maritime Connectivity
05/15/2026 | Globe NewswireRed Cat Holdings, Inc. , a U.S.-based provider of advanced all-domain drone and robotic solutions for defense and national security, announced that Kymeta, a world-leading flat-panel satellite terminal manufacturer, has joined the Red Cat Futures Initiative, the company’s industry-wide consortium accelerating advanced autonomous systems for modern warfare.
SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.
System Architecture Beyond the Die With Advanced Packaging as the Scaling Factor
05/14/2026 | Chetan Arvind Patil, Marvell TechnologyIn conventional monolithic semiconductor design, system integration was achieved within a single die and constrained by reticle limits. Compute cores, cache, memory controllers, and input output (I/O) interfaces were all co-optimized on a single process node, with performance closely tied to transistor density and on-die interconnect efficiency. This monolithic system-on-chip (SoC) approach enabled low-latency communication and relatively straightforward power delivery. However, as design for compute-intensive SoCs approaches reticle limits and advanced-node costs increase, the ability to continue scaling within a single die begins to diminish.
Rethinking Reinforcement Materials for Advanced Packaging
05/14/2026 | Ivana Ivanovic, Flexiramics B.V.Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
Below the Surface: Active Component and Module Submounts—The Architecture Behind Performance
05/14/2026 | Chandra Gupta -- Column: Below the SurfaceIf you were to peel back the layers of a modern electronic system, such as a satellite transceiver, a LiDAR module, or a 5G base station, you would not immediately notice a specific component doing some of the most important work. It doesn’t amplify signals, emit light, or process data, yet without it, none of those functions would be stable, reliable, or scalable. That component is the active device submount.