Global Sourcing Spotlight: How Global Sourcing Drives Innovation
One World, One Industry: IPC APEX EXPO 2025 Marks a Special Anniversary Year
Nolan’s Notes: Your Golden Ticket
MacDermid Alpha to Present Advantages of Solder Paste in Shingling Interconnection at SNEC PV Power Expo
July 31, 2020 | MacDermid Alpha Assembly DivisionEstimated reading time: 1 minute
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will be presenting a technical paper on the “Advantages of Solder Paste in Shingling Interconnection” during the SNEC 14th (2020) International Photovoltaic (PV) Power Generation and Smart Energy Exhibition & Conference taking place from August 7-10 in Shanghai, China.
The paper, “Advantages of Solder Paste in Shingling Interconnection” will focus on the use of solder paste in novel PV assembly techniques such as shingling and will be presented by Narahari Pujari, Global Technology Manager – PV, MacDermid Alpha.
“Shingling interconnection allows an increase of module power output without introducing substantial modification in the cell or assembly process. Conventionally, the interconnection in shingling is achieved by ECA (electrically conductive adhesive) gluing. However, long term outdoor performance data proving their stability against environmental influences has produced mixed results. Further, cost of the ECA is a big limiting factor in the price sensitive PV market,” comments Narahari Pujari. “Solder paste is a natural choice in any interconnection technology, including PV as it has a proven record in the semiconductor industry and is much more cost effective.”
He continues, “In this work, we investigated the application of solder pastes in shingle cell interconnection. Our findings confirm that solder paste can be used in this technology as a joining material and can produce the required strength and reliability as per IEC61215 which is standard for accelerated aging tests”.
Pujari’s presentation will give further insights of various solder pastes that can be used in shingling as well as other advanced PV interconnection technologies.
For more information on Alpha’s solutions for Photovoltaic applications, please visit MacDermidAlpha.com.
Share on:
Suggested Items
AIM Solder Partners with Performance Technologies Group for Sales Representation in Northeast US
03/12/2025 | AIM SolderAIM Solder, a global leader in solder assembly materials for the electronics industry, is excited to announce its new partnership with Performance Technologies Group, Inc. (PTG), an established electronic manufacturers’ representative.
Indium Corporation, Industry Partners to Showcase Products 'Live@APEX'
03/10/2025 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from March 18-20 in Anaheim, California.
Indium Experts to Present on Solder and Thermal Solutions at APEX 2025
03/07/2025 | Indium CorporationAs a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.
Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025
03/05/2025 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.
Black Diamond Orders Hentec Industries/RPS Automation Vector 300 with EMP Upgrade
03/03/2025 | Hentec Industries/RPS AutomationThe Vector 300 is the most compact model in the selective soldering Vector series lineup, making it ideal for facilities with limited space. Despite its size, the Vector 300 can process boards up to 300 x 300 mm (11.8 x 11.8 in.).