-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSupply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
MacDermid Alpha to Present Advantages of Solder Paste in Shingling Interconnection at SNEC PV Power Expo
July 31, 2020 | MacDermid Alpha Assembly DivisionEstimated reading time: 1 minute

The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will be presenting a technical paper on the “Advantages of Solder Paste in Shingling Interconnection” during the SNEC 14th (2020) International Photovoltaic (PV) Power Generation and Smart Energy Exhibition & Conference taking place from August 7-10 in Shanghai, China.
The paper, “Advantages of Solder Paste in Shingling Interconnection” will focus on the use of solder paste in novel PV assembly techniques such as shingling and will be presented by Narahari Pujari, Global Technology Manager – PV, MacDermid Alpha.
“Shingling interconnection allows an increase of module power output without introducing substantial modification in the cell or assembly process. Conventionally, the interconnection in shingling is achieved by ECA (electrically conductive adhesive) gluing. However, long term outdoor performance data proving their stability against environmental influences has produced mixed results. Further, cost of the ECA is a big limiting factor in the price sensitive PV market,” comments Narahari Pujari. “Solder paste is a natural choice in any interconnection technology, including PV as it has a proven record in the semiconductor industry and is much more cost effective.”
He continues, “In this work, we investigated the application of solder pastes in shingle cell interconnection. Our findings confirm that solder paste can be used in this technology as a joining material and can produce the required strength and reliability as per IEC61215 which is standard for accelerated aging tests”.
Pujari’s presentation will give further insights of various solder pastes that can be used in shingling as well as other advanced PV interconnection technologies.
For more information on Alpha’s solutions for Photovoltaic applications, please visit MacDermidAlpha.com.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Indium Corporation Promotes Two Leaders in EMEA (Europe, Middle East, and Africa) Markets
08/05/2025 | Indium CorporationWith its commitment to innovation and growth through employee development, Indium Corporation today announced the promotions of Andy Seager to Associate Director, Continental Sales (EMEA), and Karthik Vijay to Senior Technical Manager (EMEA). These advancements reflect their contributions to the company’s continued innovative efforts with customers across Europe, the Middle East, and Africa (EMEA).
MacDermid Alpha Electronics Solutions Unveils Unified Global Website to Deepen Customer, Talent, and Stakeholder Engagement
07/31/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, the electronics business of Elements Solutions Inc, today launched macdermidalpha.com - a unified global website built to deepen digital engagement. The launch marks a significant milestone in the business’ ongoing commitment to delivering more meaningful, interactive, and impactful experiences for its customers, talent, and stakeholders worldwide.
KOKI to Showcase Analytical Services and New HF1200 Solder Paste at SMTA Guadalajara 2025
07/31/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, will exhibit at the SMTA Guadalajara Expo & Tech Forum, taking place September 17 & 18, 2025 at Expo Guadalajara, Salón Jalisco Halls D & E in Guadalajara, Mexico.
Weller Tools Supports Future Talent with Exclusive Donation to SMTA Michigan Student Soldering Competition
07/23/2025 | Weller ToolsWeller Tools, the industry leader in hand soldering solutions, is proud to announce its support of the upcoming SMTA Michigan Expo & Tech Forum by donating a limited-edition 80th Anniversary Black Soldering Set to the event’s student soldering competition.
Koh Young Appoints Tom Hattori as President of Koh Young Japan
07/21/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, announced the appointment of Tom Hattori as President of Koh Young Japan (JKY).