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Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup

01/07/2025 | Vern Solberg -- Column: Designer's Notebook
To accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.

Revolutionizing Inner Layer Registration

12/26/2024 | Marcy LaRont, I-Connect007
In this interview with Anthony (Tony) Faraci, founder and president of DIS, we delve into enhancing inner layer accuracy and yields, pivotal to boosting profitability in the circuit board industry. Tony has extensive experience in the development of tooling technology over the decades, which ultimately led to his founding DIS. From his beginnings at Multiline to tackling the challenges of registration accuracy, Tony's insights clearly lay out the complexities of modern manufacturing and the innovations in shaping the future of inner layer registration.

Effects of Advanced Packaging and Stackup Design

12/26/2024 | I-Connect007 Editorial Team
Kris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”

Dicro Accepted as a Member of the Defence and Aerospace Industry Association PIA

12/18/2024 | Dicro Oy
Dicro is proud to announce that the company has been accepted as a member of the Defence and Aerospace Industry Association PIA, starting from January 1, 2025. This membership reinforces Dicro's commitment to high-quality and innovative solutions in the defence and aerospace sectors.

Marcy’s Musings: Boosting Your Inner Layer Precision and Production Outcomes

12/17/2024 | Marcy LaRont -- Column: Marcy's Musings
If you went to college, it’s likely you did so because your parents told you that getting your education would provide a firm foundation to build a successful career. But attending college is not the end-all, be-all of creating a successful career, especially in our industry which offers many great opportunities that do not require that kind of higher education. Of course, you can’t argue that education and training provide a solid foundation upon which to build and lead to eventual success in an undertaking.
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