Analog Devices Collaborates with Intel on Radio Platform to Address 5G Network Design Challenges
August 3, 2020 | Business WireEstimated reading time: 1 minute
Analog Devices, Inc. announces its collaboration with Intel Corporation to create a flexible radio platform that addresses 5G network design challenges and will enable customers to scale their 5G networks more quickly and economically. The new radio platform combines the advanced technology of ADI’s radio frequency (RF) transceivers with the high performance and low power of Intel Arria 10 Field Programmable Gate Arrays (FPGAs) giving developers a new set of design tools for more easily creating optimized 5G solutions.
The communications market is moving at a rapid pace to keep up with the strains put on bandwidth and latency as more people transact business digitally and consume and transmit data from everywhere. A significant increase in traffic over existing wireless networks is occurring in both private networks and public spaces. As a result, wireless operators are looking to shorten development times and cost-effectively implement new solutions that increase the capacity, performance and reliability of 5G networks. Through a mix of open standards and existing communication links, mobile network operators are developing a broader set of specifications and supporting a growing span of use cases.
“This new radio platform reduces the overall cost of design and quickens our customers’ time to market without sacrificing system-level performance,” said Joe Barry, Vice President of the Wireless Communications Business Unit at ADI. “By coupling ADI’s transceivers featuring advanced digital frontend (DFE) functionality with Intel’s leading FPGA technology, our customers’ solutions can achieve the high level of performance they require while increasing their flexibility to more efficiently resolve emerging network issues.”
The high-performance, O-RAN compliant solution uses ADI’s market-leading software defined transceiver, which includes an innovative DFE capability, with Intel’s Arria A10 FPGA to create a highly flexible architecture. The collaboration will allow designers to customize frequency, band and power to achieve higher system performance at lower cost.
“This collaboration between ADI and Intel enables the development of new radio solutions for 5G networks,” said CC Chong, Senior Director, Head of Wireless & Access, Programmable Solution Group at Intel. “We look forward to working with ADI to expedite hardware development by offering FPGA platforms that are flexible to meet changing requirements, are easy to use, and remove many of the complex barriers of RF and digital product development.”
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
It’s Only Common Sense: Marketing Isn’t Fluff, It’s Ammunition
11/03/2025 | Dan Beaulieu -- Column: It's Only Common SenseI’ve lost count of the times I’ve heard someone dismiss marketing as “fluff.” You know the tone: a little smirk, a little condescension, and the implication that “real companies” don’t need marketing. They say, “We make a great product. Our work speaks for itself.”
Aircraft Wire and Cable Market to surpass USD 3.2 Billion by 2034
10/30/2025 | Global Market Insights Inc.The global aircraft wire and cable market was valued at USD 1.8 billion in 2024 and is estimated to grow at a CAGR of 5.9% to reach USD 3.2 billion by 2034, according to recent report by Global Market Insights Inc.
The Marketing Minute: Marketing With Layers
10/15/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing to a technical audience is like crafting a multilayer board: Each layer serves a purpose, from the surface story to the buried detail that keeps everything connected. At I-Connect007, we’ve learned that the best marketing campaigns aren’t built linearly; they’re layered. A campaign might start with a highly technical resource, such as an in-depth article, a white paper, or a podcast featuring an engineer delving into the details of a process. That’s the foundation, the substance that earns credibility.
ICT Symposium Review: Sustainability and the Circular Economy
10/09/2025 | Pete Starkey, I-Connect007It was pleasant autumnal weather as we made our way once again to Meriden, the nominal centre of England, for the 2025 Annual Symposium of the Institute of Circuit Technology. Delegates were welcomed by technical director Emma Hudson who introduced and moderated a skilfully coordinated programme, focused on the highly relevant theme of sustainability.
Circular Packaging Market to Reach $98.0 Billion by 2035
10/08/2025 | Fact.MRThe market's journey from USD 45.8 billion in 2025 to USD 98.0 billion by 2035 represents substantial growth, the market will rise at a CAGR of 7.9% demonstrating the accelerating adoption of sustainable packaging systems and circular economy solutions across food & beverage, personal care, and e-commerce sectors.