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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Intel Names New Leader at Intel Foundry to Accelerate Manufacturing

06/22/2026 | Intel
Intel Corporation announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan.

TSMC Accelerates CoPoS Development; Taiwan Suppliers Leverage FOPLP for Glass Core Substrates

06/17/2026 | TrendForce
The rapid growth of demand for AI semiconductors is driving the evolution of advanced packaging technologies, with Fan-Out Panel-Level Packaging (FOPLP) emerging as a new battleground across the industry.

TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the US

06/16/2026 | BUSINESS WIRE
Taiwan Semiconductor Manufacturing Company and Amkor Technology, Inc. announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor packaging capabilities in Arizona, strengthening and accelerating investment in the U.S. semiconductor supply chain ecosystem.

SEMICON Taiwan 2026 to Serve as Global Stage Where the Semiconductor Industry Defines What’s Next

06/16/2026 | SEMI
SEMICON Taiwan 2026, one of the global semiconductor industry’s flagship annual events, will be held September 2-4 at the Nangang Exhibition Center in Taipei, with forums beginning on August 31 to align with International Semiconductor Week.

Advanced Packaging: A Central Axis of Innovation in A&D, Automotive

06/11/2026 | I-Connect007 Editorial Team
Presenters in the Aerospace & Defense Special Session at APEX EXPO 2026 made one message abundantly clear: Advanced packaging has moved from a supporting role to a primary system enabler, particularly in high-reliability markets where performance, longevity, and environmental resilience are non-negotiable. The March Technical Conference at APEX EXPO focused on advanced electronics for the first time this year, with two Special Sessions featuring a carefully curated selection of presentations examining how design priorities, material choices, and manufacturing strategies are evolving in response to these demands.
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