Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
TopLine Files for US Patent for Pb-free Solder Column
August 12, 2020 | TopLineEstimated reading time: Less than a minute
TopLine Corporation announced that Martin Hart, CEO of TopLine and inventor, has filed for a US Patent for a lead (Pb) free solder column used in the manufacture of Field Programmable Gate Array (FPGA) devices. The unique new product has been developed in anticipation of RoHS requirements for Pb free columns.
In making the announcement, Hart said, “Historically, the aerospace and defense industry has largely been exempt from meeting the requirements of the EU RoHS directive regulating the use of lead in solder columns. It is widely speculated that one day, RoHS will stop renewing its exemption allowing lead bearing solder balls and solder columns. Doing so could trigger unintentional consequences by forcing Original Design Manufacturers (ODMs) to convert to fully lead-free FPGA products. This product is designed to anticipate and meet future needs for lead-free columns.”
Heritage hardware used in the Aerospace and Defense industries are built on a platform of FPGA devices built with solder columns instead of solder balls, Hart adds. Column Grid Array (CGA) FPGA packages engaged in mission-critical black box systems have shown to be more reliable than Ball Grid Array (BGA) packages, absorbing stress and increasing solder joint reliability under harsh operating conditions.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.