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AIM’s Flopy Feng to Present at SMTA China South Technical Conference
August 18, 2020 | AIM SolderEstimated reading time: Less than a minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Flopy Feng will present at the 2020 SMTA China South Technology Conference at the Shenzhen Convention & Exhibition Center in Shenzen, China. Flopy’s presentation, “Pin-In-Paste,” is scheduled for August 26th, 2020 from 11:05-11:40.
The presentation will detail the Pin-in-Paste (PiP) process including PCB and stencil design considerations as well as solder paste selection and reflow guidelines. The PiP technique can be more cost effective by eliminating the need for a wave or selective soldering process and the associated costs. Learn more on www.aimsolder.com.
Flopy Feng is a technical support manager for AIM Solder. Having worked as a process supervisor for seven years, he is experienced in process evaluation and optimization. With over 15 years’ of experience in the SMT industry, Flopy supports AIM customers in south China.
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