-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Indium Corporation Expert to Present at CHARGED EVs Virtual Conference
August 18, 2020 | Indium CorporationEstimated reading time: 1 minute

Indium Corporation’s Joseph Hertline, Product Manager – ESM/Power Electronics, will present on materials solutions for high-reliability power electronics assembly during CHARGED Electric Vehicles (EVs) virtual conference, Sept. 1-3.
As power devices evolve to handle increased power density, higher junction temperatures, and smaller packaging, the enhanced requirements for high-reliability power electronics have posed many challenges to the packing and assembly processes. During The Challenges of High-Reliability Power Electronics Assembly and the Emerging Materials Solutions, Hertline will analyze the major challenges within substrate- and die-attach applications, as well as provide an overview of the innovative materials solutions that can help achieve high power density and promote better heat dissipation, resulting in highly-reliable power devices.
Hertline is the Product Manager for engineered solder materials focusing on power electronics applications. He is responsible for driving the growth of the power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. He also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. Prior to joining Indium Corporation in the spring of 2020, Hertline spent more than 10 years as an engineer and product manager in the electronics industry. He earned a bachelor's degree in mechanical engineering and an MBA from Clarkson University in Potsdam, NY.
CHARGED EVs virtual conference includes live webinar sessions and interactive Q&As, as well as new on-demand webinars and whitepaper downloads available in the weeks leading up to the event. Conference topics will span the entire EV engineering supply chain and ecosystem, including motor and power electronics design and manufacturing, cell development, battery systems, testing, powertrains, thermal management, circuit protection, wire and cable, EMI/EMC, and more.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com.
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.