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Seika Machinery Highlights Stencil Cleaner and More in SMTAI Virtual Expo
August 31, 2020 | Seika Machinery, Inc.Estimated reading time: 1 minute
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to announce its participation in the SMTA International Virtual Conference & Exposition. The Live Virtual Expo is scheduled to take place Sept. 28-30, 2020. Seika will highlight the Sawa SC-BM500E Automatic Ultrasonic Metal Stencil Cleaner, Sayaka SAM-CT34NJW Twin Table PCB Router with online camera for programming, Tsuchiyama n=1 Checker FAI and Kyowa PCAS Software Series for PCB Measurement.
The Sawa SC-BM500E offers precise cleaning with an ultrasonic Cleaning head designed for a variety of applications, including wafer bump and electroform stencils.
It accommodates a wide range of stencils from 320mm×320mm to 1000×740mm, and is ideal for customers using multiple types of stencils. The SC-BM500E is available in three models to accommodate specific customer needs and can clean mesh screens as well remove ink, adhesives and solder paste. Misprinted PCBs can also be cleaned in SC-BM500-E.
The Sayaka Twin Table Router features advanced image-processing software with point-and-click operation for programming router paths. The CCD camera captures an image of the PCB, while programming cutting paths is achieved by simple point-and-click operation on screen. An ideal solution for stress-free depanelization, the high-speed router bit cleanly and precisely cuts densely populated PCBs without stressing the PCB.
The Malcom SWB-2 Wetting Balance Tester takes the "Dip & Look" method to the next level by actually measuring the wetting forces during the soldering process. The tester has been designed to evaluate the effectiveness of different solder and flux combinations on a standardized test coupon, or your own test pieces.
The n=1 revolutionary automatic first-article inspection tool checks component presence and orientation and verifies LCR values (induction, capacitance, resistance) 10x faster. Additionally, it speeds up visual inspection with camera magnification.
The PCAS Series enables users to evaluate printed circuit assemblies (PCAs) easily with intuitive operation. Perform real-time recording, analyze data and create reports in accordance with IPC/JEDEC-9704A with the easy-to-use measurement software.
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Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.