-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
MacDermid Alpha’s Kester Brand to Exhibit at China International Optoelectronic Exposition
September 2, 2020 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute

The Kester brand of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will be represented by China Distributor, Shanghai Fairfield Electronic Technology Co., Ltd., at the China International Optoelectronic Exposition (CIOE) in Shenzhen, China from September 9-11.
Kester will be highlighting its tacky solder flux and solder paste portfolio. Kester Tacky Solder Fluxes (TSFs) are the industrial standard for Flip Chip and BGA Sphere Attach. With viscosities optimized for high speed application and holding of a chip or sphere in place prior to reflow, Kester TSFs enable wide process windows for our users. Known for their active soldering, Kester TSFs ensure good electrical connections on known good die and components. Featured products include TSF-6522RH, TSF-ULR18, and TSF-WS917.
Additionally Kester will exhibit three of its leading solder pastes. Kester NP560 is a no-clean, lead-free, halogen-free solder paste that has redefined the voiding standard for PCB assembly. This paste consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. Kester NP545 is a zero-halogen, lead-free, no-clean solder paste formula designed for consistency and repeatability, and Kester NP505-HR is a zero-halogen, lead-free, no-clean solder paste formula developed specifically for high reliability applications.
For more information on Kester’s Tacky Solder Flux and Solder Paste solutions, please visit Kester in Hall: 8, Booth No:8E161 or visit the www.kester.com.
China International Optoelectronic Exposition (CIOE 2020)
Dates: September 9-11, 2020
Venue: Shenzhen World Exhibition & Convention Center
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Kester and MacDermid Enthone brands, we provide solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.