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Beat the Heat With New Book on Thermal Management Design Processes
September 15, 2020 | I-Connect007Estimated reading time: 1 minute
Learn how to beat the heat in your designs with The Printed Circuit Designer’s Guide to…Thermal Management: A Fabricator’s Perspective—the latest title in our educational library. The Printed Circuit Designer’s Guide to… series is specifically dedicated to educating PCB designers and serves as a valuable resource for people seeking the most relevant design information available.
Thermal management is one of the fastest-growing areas of the PCB segment, far outpacing the projected growth for the overall industry. While demand was originally driven by high-power telecommunication and mil-aero applications, it has rapidly expanded to include automotive, consumer electronics, and medical sectors.
Written by Anaya Vardya, president and CEO of American Standard Circuits, this book serves as a desk reference for designers on the most current thermal management techniques and methods from a PCB fabrication perspective, including a case study on an extreme mixed-technology design. Vardya also shares considerations designers should discuss with their PCB fabricators to ensure manufacturability, cost-effective solutions, and successful product launches.
Denis Boulanger, principal manufacturing engineer at Raytheon Technologies, says, "This book provides a comprehensive look at thermal management and PCB design issues from the fabricator’s perspective. I am glad that it exists now that I have 'gone over to the dark side,' where I am a consumer rather than a fabricator and/or material supplier."
PCB designers and design engineers, both new and veteran, will gain a thorough understanding of thermal management design processes.
Download your free copy today! You can also view other titles in our full library. Check out other books from American Standard Circuits, including The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs and Flex and Rigid-Flex Fundamentals.
We hope you enjoy The Printed Circuit Designer’s Guide to…Thermal Management: A Fabricator’s Perspective.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
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North American PCB Industry Sales Down 11.1% in October
11/22/2024 | IPCIPC announced today the October 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.09.
Real Time with... electronica 2024: Inside CEE PCB—Innovations in Technology
11/22/2024 | Real Time with... electronicaMarcy LaRont Interviews Tom Yang and Jerome Larez From CEE PCB. Tom and Jerome showcase the company's advancements and emphasize the importance of automation in PCB manufacturing for quality and efficiency. The CEE PCB focuses on sustainability and aims to connect with high-tech clients while exploring new partnerships for high-volume production.
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.