Knocking Down the Bone Pile: Hot Air vs. Infrared PCB Rework
Standard of Excellence: ‘Quality’ Is Your Company's Greatest Competitive Advantage
Powering the Future: From Substrate to System—The Power Module Assembly
Four Indium Corporation experts will share their industry knowledge and expertise during a live virtual exposition at SMTA International from Sept. 28-30.
The following technical papers from Indium Corporation experts will be featured:
- Versatile TIM Solution with Chain Network Solder Composite by Dr. Ning-Cheng Lee, Vice President of Technology
- An Alternative Lead-Free, Low-Temperature Solder with Excellent Drop Shock Resistance by Dr. HongWen Zhang, R&D Manager, Alloy Group
- Fine Powder Investigation for Optimum Imperial 008004 Solder Paste Printing: Part I by Adam Murling, Assistant Engineering Manager—Technical Support
- Process Optimization for Reducing Solder Paste Splatter During Reflow by Leon Rao, Senior Technical Support Engineer
SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA—the world's leading user group for surface mount and companion technologies. The conference provides high-quality technical information and networking opportunities. Attendees who register for the Technical Conference will have exclusive access to over 100 technical presentations on-demand from Sept. 28-Oct. 23, as well as the ability to download all papers in the conference proceedings.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA. Visit indium.com.
