IPC E-Textiles 2020 Virtual Summit Offers Top-notch Education
September 3, 2020 | IPCEstimated reading time: 1 minute

The IPC E-Textiles 2020 Virtual Summit, to be held Oct. 1 and 2, is a two-day event consisting of educational workshops, interactive panel discussions, and a tour of the University of Minnesota Wearable Technology Lab. IPC E-Textiles 2020 Virtual Summit is an ideal event for companies actively involved in e-textiles development, such as EMS and OEM companies, or product innovators and materials suppliers investigating how to apply e-textiles technologies to future products.
Registrants get early access
IPC is launching a new online educational community within IPC EDGE for the e-textiles industry and wants IPC E-Textiles 2020 Virtual Summit registrants to be the first to take advantage of this new offering. IPC will send exclusive passes to registrants this month.
The following is the agenda for IPC E-Textiles 2020 Virtual Summit. Workshops will be split into morning and afternoon sessions, and IPC will record all workshops for attendees who can’t attend all four sessions.
Workshops
October 1:
E-Textiles Products for Consumer and Medical Applications
Speakers: Madison Maxey, LOOMIA; Md. Tahmidul Islam Molla, Cornell University; and Paul J. Wagner, Minnesota Wire
Material Issues and Wash Factors
Speakers: Chuck Kinzel, Liquid Wire; Lauren Cantley, MIT Lincoln Laboratory; and Mary Johnson, P+G Fabric and Air Care
October 2:
E-Textiles for Defense and Government Applications
Speakers: Brian Farrell, Human Systems Integration and Carole Winterhalter, U.S. Army Combat Capabilities Development Command
University of Minnesota Wearable Technology Lab Demonstrations
During this session, students and faculty will provide demonstrations and discussions on recent projects and lab capabilities, as well as a virtual tour of the Wearable Technology Lab.
Registration for IPC E-Textiles 2020 is $120 for IPC members, $150 for nonmembers. Sponsorships are available, starting at $500. For more information about the conference, visit www.ipc.org/E-Textiles-NA or e-mail Chris Jorgensen, IPC director of technology transfer.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
CEE PCB Launches PCBpedia: A New Knowledge Hub for Circuit Board Technology
09/03/2025 | CEE PCBCEE PCB, a leading manufacturer of PCBs and FPCs, is responding to the growing demand for reliable technical knowledge. With PCBpedia, CEE introduces a new knowledge platform featuring expert articles on key topics in circuit board technology – from FPC design rules to surface finishes.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
08/21/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal third quarter ended July 31, 2025. Sales were $742 million compared to the prior year’s third quarter sales of $662 million.