Powering the Future: Why True Ceramic Circuits Are Not Just ‘Better PCBs’
Global Sourcing Spotlight: The Global Quality Gap—Why Consistency Wins the Contract
Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components
Four Indium Corporation experts will share their industry knowledge and expertise during a live virtual exposition at SMTA International from Sept. 28-30.
The following technical papers from Indium Corporation experts will be featured:
- Versatile TIM Solution with Chain Network Solder Composite by Dr. Ning-Cheng Lee, Vice President of Technology
- An Alternative Lead-Free, Low-Temperature Solder with Excellent Drop Shock Resistance by Dr. HongWen Zhang, R&D Manager, Alloy Group
- Fine Powder Investigation for Optimum Imperial 008004 Solder Paste Printing: Part I by Adam Murling, Assistant Engineering Manager—Technical Support
- Process Optimization for Reducing Solder Paste Splatter During Reflow by Leon Rao, Senior Technical Support Engineer
Dr. Lee will also host the professional development course, Achieving High-Reliability for Lead-Free Solder Joints—Materials Consideration.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com
