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Suggested Items

System Architecture Beyond the Die With Advanced Packaging as the Scaling Factor

05/14/2026 | hetan Arvind Patil, Marvell Technology
In conventional monolithic semiconductor design, system integration was achieved within a single die and constrained by reticle limits. Compute cores, cache, memory controllers, and input output (I/O) interfaces were all co-optimized on a single process node, with performance closely tied to transistor density and on-die interconnect efficiency. This monolithic system-on-chip (SoC) approach enabled low-latency communication and relatively straightforward power delivery. However, as design for compute-intensive SoCs approaches reticle limits and advanced-node costs increase, the ability to continue scaling within a single die begins to diminish.

Rethinking Reinforcement Materials for Advanced Packaging

05/14/2026 | Ivana Ivanovic-Hesselink, Flexiramics B.V.
Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.

Road to Reliability: Engineering High Uptime EV Charging Infrastructure

05/13/2026 | Stanton Rak, SF Rak Company
The transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.

Protecting Advanced Trucking Electronics in Harsh Environments

05/13/2026 | Beth Massey, MacDermid Alpha Electronics Solutions
For decades, trucking was defined by horsepower, payload, and driver endurance. Today, the competitive edge lies in electronics, as advanced sensing, communications, and data processing systems reshape how commercial vehicles operate. The industry is rapidly digitizing, with electronic systems now critical to safety, uptime, and fleet efficiency. Technologies like ADAS, radar, lidar, and telematics enable real-time decision-making, while distributed sensors monitor key vehicle functions. Because these systems operate in harsh conditions, environmental protection using potting, coatings, and encapsulation is now a core design priority.

I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest

05/13/2026 | I-Connect007
The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.
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