-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Trackwise Implements Further Upgrading of FPC Manufacturing Operations
September 8, 2020 | TrackwiseEstimated reading time: 1 minute

Trackwise, a recognised innovator of flexible printed circuit (FPC) technology, continues to strengthen its production capability and capacity by investing in new equipment. The company has installed a highly advanced roll-to-roll direct imaging system and has also invested in a roll-to-roll flexible circuit laser drilling system.
Situated in the manufacturer’s recently commissioned Class 7 cleanroom facility, the new direct imaging system is able to deal with features down to dimensions of just 25µm as well as providing significantly increased throughput. Given that the system is also suitable for use on a much wider range of photo-imageable materials, the investment provides a significant increase in capability and capacity to Trackwise’ length-unlimited FPC manufacturing.
The recently purchased high-power diode-pumped UV laser is capable of processing extremely thin and sensitive FPCs at high throughput, maintaining processing accuracies of ± 20µm over the entire panel area. An advanced web handler compensates for the continual acceleration and deceleration during production avoiding wrinkling and other stretching issues. The drill’s power and precision boosts cycle times, further improving process quality and yield.
This investment, as well as the acquisition of Stevenage Circuits Ltd (SCL) earlier this year, will enable Trackwise to significantly boost its operational throughput and address constantly growing customer interest in FPCs based on its proprietary Improved Harness Technology™ (IHT).
IHT enables the fabrication of ultra-thin FPCs with very fine traces that can meet any potential length requirement. Competing solutions are generally restricted to just a couple of metres. Consequently, Trackwise FPCs represent an attractive alternative to conventional cable harnesses, with substantial weight and space savings being realised, as well as better heat dissipation and heightened reliability.
“The ongoing capital investment we are making into state-of-the-art equipment and cleanroom resources underlines our clear commitment to gaining greater traction for our IHT and high-precision printed antenna solutions,” Philip Johnston, CEO of Trackwise explains. “Through these activities, we are now much better positioned to serve future market opportunities as they arise – supporting greater volume demands, as well as providing enhanced levels of quality.”
Suggested Items
OSI Systems Receives $34 Million Contract for Cargo and Vehicle Inspection Systems
07/11/2025 | BUSINESS WIREOSI Systems, Inc. announced that its Security division has been awarded a contract worth approximately $34 million by an international customer.
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.
OSI Systems Lands $17 Million Order for Cargo and Vehicle Inspection Systems
07/07/2025 | BUSINESS WIREOSI Systems, Inc. announced that its Security division received an order valued at approximately $17 million from an international customer for cargo and vehicle inspection systems.
KYOCERA AVX Releases New 3DB Hybrid Couplers
07/04/2025 | PRNewswireKYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released a new line of integrated thin film (ITF) hybrid couplers designed to facilitate the continued evolution of high-frequency wireless systems in industrial, automotive, telecommunications, and telemetry applications.
Accenture Acquires SYSTEMA to Drive Manufacturing Automation for Semiconductor Clients
07/02/2025 | AccentureAccenture has acquired SYSTEMA, a provider of software solutions and consulting services for manufacturing automation, headquartered in Dresden, Germany.