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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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What EMS Firms Want From Their Software—and What They Get
September 3, 2025 | Thiago Guimaraes, Global Electronics AssociationEstimated reading time: 1 minute
Last November, the Global Electronics Association [as IPC] surveyed EMS and OEM companies to better understand the software tools driving their operations and uncover trends in adoption, satisfaction, and challenges.
The survey assessed software tools across critical functions, including ERP, MES, PLM, QMS, LMS, quoting systems, and CRM. Participants shared insights on tool adoption, satisfaction, and selection priorities.
A total of 82 qualified individuals completed the survey. Respondents spanned EMS and OEM organizations across North America, Europe, Asia, and the Middle East/Africa, with company revenues ranging from under $5 million to over $1 billion.
This article offers a first look at findings from the 2024 EMS Software Survey, which explores how electronics manufacturers select, implement, and assess core business software. The full report, slated for release later this summer, will include detailed benchmarking data and perspectives on satisfaction, integration, and legacy system challenges.
Aging Infrastructure, Rising Expectations
In electronics manufacturing, digital tools often stick around long past their prime. Nearly 60% of ERP and QMS systems have been in place for over a decade, anchoring operations while complicating efforts to modernize.
MES tools show a similar age profile, but with lower adoption and less functionality—revealing a sector still wrestling with paper-based processes, disconnected systems, and limited visibility. As the industry sets its sights on AI, automation, and real-time traceability, the question isn’t just which systems to adopt, but how to navigate the opportunity cost of updating these well-entrenched legacy systems.
To continue reading this article, which originally appeared in the August 2025 issue of SMT007 Magazine, click here.
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From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
RTX's Raytheon Completes First Flight Test for RAIVEN® Sensing System
04/15/2026 | RTXRaytheon, an RTX business, has successfully completed the first flight test of its RAIVEN® Staring system, an air-cooled sensor suite that delivers greater situational awareness and operator survivability, on a UH-60 Black Hawk helicopter.
HYFIX Raises $15M to Build U.S.-Made Chips for Next-Gen Drones and Robots
04/15/2026 | PRNewswireHYFIX Spatial Intelligence, Inc., a U.S.-based semiconductor company, announced a $15 million seed round to build and manufacture a new class of American-made chips designed to power high-precision drones and autonomous robots.
Carbice Awarded Multi-Million Dollar U.S. Navy Contract for Thermal Assembly Joint Technology
04/14/2026 | PRNewswireCarbice, a U.S.-based manufacturer and supplier of novel multifunctional assembly joint technologies, has been awarded a multi-million dollar contract by the U.S. Navy's Office of Naval Research.