Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Mycronic Receives Order for MYPro Line Solution for Flexible Electronics Manufacturing
September 28, 2020 | Mycronic ABEstimated reading time: 1 minute
Mycronic, the leading Swedish high-tech company providing production equipment to the electronics industry, has received an order for a complete MYPro Line solution comprising two fully automated and complete assembly lines including intelligent component storage and software tools for process monitoring. Flexibility, process control, high productivity and superior production quality have been key factors in choosing Mycronic as a supplier. The net value of the order amount to approximately USD 3 million and is expected to be installed at customer site end of 2020.
Mycronic’s MYPro Line solution is receiving high interest from customers. The solution is a complete SMT assembly line, designed for smart factory connectivity. The order comprises of state-of-the-art jet printing technology, versatile pick-and-place equipment, high-accuracy 3D inspection systems, intelligent storage solutions and software tools for process control. With the MYPro Line, customers can achieve a more flexible and profitable electronics production.
“We are very proud that customers value our technology and invest in our full-line solutions. It demonstrates that we are creating production solutions that the market is looking for, and help our customers to improve profitability and expand their business,” says Clemens Jargon, Acting Sr VP Assembly Solutions High Flex at Mycronic.
Mycronic’s MYPro Line - one intelligent SMT line from a single vendor
With one integrated line from a single vendor, manufacturers benefit from continuous process improvement, real-time production insights and proactive component replenishment.
The MYPro Line offering comprises the following key technologies and process steps:
- MY700 Jet Printer and Jet Dispenser – high-speed and high-precision jetting of solder paste and assembly fluids
- PI 3D SPI – high-accuracy solder paste inspection of printed circuit boards
- MY300 pick-and-place – versatile assembly equipment offering full flexibility from batch-size-one to series production
- K 3D AOI – advanced automated optical inspection of printed circuit boards
- SMD Tower – intelligent and compact component storage systems
- Mycronic’s Assembly Process Management software suite - tailored software tools for process control of the most complex manufacturing environments
About Mycronic
Mycronic AB is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in France, Japan, China, the Netherlands, Singapore, the United Kingdom, South Korea, Germany and the USA. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.