-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Mycronic Receives Order for MYPro Line Solution for Flexible Electronics Manufacturing
September 28, 2020 | Mycronic ABEstimated reading time: 1 minute

Mycronic, the leading Swedish high-tech company providing production equipment to the electronics industry, has received an order for a complete MYPro Line solution comprising two fully automated and complete assembly lines including intelligent component storage and software tools for process monitoring. Flexibility, process control, high productivity and superior production quality have been key factors in choosing Mycronic as a supplier. The net value of the order amount to approximately USD 3 million and is expected to be installed at customer site end of 2020.
Mycronic’s MYPro Line solution is receiving high interest from customers. The solution is a complete SMT assembly line, designed for smart factory connectivity. The order comprises of state-of-the-art jet printing technology, versatile pick-and-place equipment, high-accuracy 3D inspection systems, intelligent storage solutions and software tools for process control. With the MYPro Line, customers can achieve a more flexible and profitable electronics production.
“We are very proud that customers value our technology and invest in our full-line solutions. It demonstrates that we are creating production solutions that the market is looking for, and help our customers to improve profitability and expand their business,” says Clemens Jargon, Acting Sr VP Assembly Solutions High Flex at Mycronic.
Mycronic’s MYPro Line - one intelligent SMT line from a single vendor
With one integrated line from a single vendor, manufacturers benefit from continuous process improvement, real-time production insights and proactive component replenishment.
The MYPro Line offering comprises the following key technologies and process steps:
- MY700 Jet Printer and Jet Dispenser – high-speed and high-precision jetting of solder paste and assembly fluids
- PI 3D SPI – high-accuracy solder paste inspection of printed circuit boards
- MY300 pick-and-place – versatile assembly equipment offering full flexibility from batch-size-one to series production
- K 3D AOI – advanced automated optical inspection of printed circuit boards
- SMD Tower – intelligent and compact component storage systems
- Mycronic’s Assembly Process Management software suite - tailored software tools for process control of the most complex manufacturing environments
About Mycronic
Mycronic AB is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in France, Japan, China, the Netherlands, Singapore, the United Kingdom, South Korea, Germany and the USA. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.